Precision Wafer Dicing Technician (2nd Shift)

Teledyne Technologies Incorporated; Camarillo (CA); On-site; USD 52,000 - 69,000; Full time

Benefits offered by this job

Competitive salary

Health coverage from Day 1

PTO & holidays

401(k) match

Employee stock plan

Tuition reimbursement

Employee events

Job summary

Teledyne Imaging Sensors is seeking a Wafer Dicing Technician to join our mission-focused team. You will support daily wafer dicing operations, coordinate with engineers on quality control, and ensure accurate data recording through MES.

The role requires working second or split shifts, strong mechanical drawing skills, and proficiency with metrology tools and digital microscopy. A high school diploma plus relevant experience is required, with citizenship due to access restrictions.

Qualifications

• Ability to work second shift or split shift.
• Strong understanding of mechanical drawings on dimensions and tolerances.
• Proficiency with digital microscope and metrology tools.
• Proficiency with Microsoft Word, PowerPoint, and Excel.
• Manual dexterity to handle small, precision components.
• High School Diploma with 3 years of relevant experience.
• U.S. citizenship due to access restrictions.

Responsibilities

• Support daily wafer dicing operation including container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.
• Collaborate with engineers on dicing operation for quality control, process control and continuous improvements.
• Document and report any nonconforming events and assist root cause analysis.
• Work with MES for process execution, data recording and reporting.
• Follow all laboratory protocols and safety procedures.
• Assist with maintaining equipment to ensure optimal operation and proper calibration.

Skills

Second shift capability

Mechanical drawings

MS Office proficiency

Manual dexterity

US citizenship

Education

High School Diploma + 3 years experience

Tools

MES

Digital microscope

Metrology tools

Job description

Teledyne Imaging Sensors is seeking a Wafer Dicing Technician to join our mission-focused team. You will support daily wafer dicing operations, coordinate with engineers on quality control, and ensure accurate data recording through MES.

The role requires working second or split shifts, strong mechanical drawing skills, and proficiency with metrology tools and digital microscopy. A high school diploma plus relevant experience is required, with citizenship due to access restrictions.