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Teledyne Technologies Incorporated in Camarillo, California, is seeking a Wafer Dicing Technician to support daily wafer dicing operations. The role requires strong mechanical drawing understanding and proficiency in metrology tools. Successful candidates will enjoy a competitive salary ranging from $50,500 to $67,300 annually, along with comprehensive health benefits and a 401(k) plan.
Join our mission-focused team and contribute to innovative projects in aerospace and defense, ensuring precision and quality standards are met.
Teledyne Technologies Incorporated in Camarillo, California, is seeking a Wafer Dicing Technician to support daily wafer dicing operations. The role requires strong mechanical drawing understanding and proficiency in metrology tools. Successful candidates will enjoy a competitive salary ranging from $50,500 to $67,300 annually, along with comprehensive health benefits and a 401(k) plan.
Join our mission-focused team and contribute to innovative projects in aerospace and defense, ensuring precision and quality standards are met.