Plating Manufacturing Engineer: Optimize Process & Yield

Headway Technologies

Milpitas (CA)

Sur place

USD 121 000 - 160 000

Plein temps

14 jours+

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Résumé du poste

Headway Technologies is seeking a Plating Manufacturing Engineer in Milpitas, CA to oversee day-to-day plating operations, including electroplating, resist stripping, and wet etching. The role focuses on improving yield, reducing costs, and implementing robust processes with data-driven analyses.

The position requires 1–3 years in semiconductor manufacturing or similar, a bachelor’s degree (master’s preferred), and proficiency in SPC/DOE and device testing (I‑V, C‑V).

Qualifications

  • Bachelor’s degree in a relevant field; Master’s degree preferred.
  • 1–3 years hands-on experience in magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role.
  • Strong experience using semiconductor device testing (I‑V, C‑V, M‑H hysteresis) and magnetoresistivity.
  • Hands-on experience in SPC and Design of Experiments (DOE).
  • Proficient in Microsoft Office applications.

Responsabilités

  • Monitors, sustains, and supports day-to-day plating manufacturing processes.
  • Provides technical support to operators, technicians, and engineers for process reliability.
  • Collaborates with development team on new plating process integration and optimizations; may lead projects.
  • Analyzes data, runs experiments, and researches cost-saving methods to reduce scrap.
  • Designs experiments to verify process robustness and reports findings.
  • Adheres to safety policies and maintains documentation and MPI’s.

Connaissances

SPC and DOE
Semiconductor device testing (I‑V, C‑V
Microsoft Office

Formation

Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics
Master’s degree preferred

Outils

JMP
Excel

Description du poste

Headway Technologies is seeking a Plating Manufacturing Engineer in Milpitas, CA to oversee day-to-day plating operations, including electroplating, resist stripping, and wet etching. The role focuses on improving yield, reducing costs, and implementing robust processes with data-driven analyses.

The position requires 1–3 years in semiconductor manufacturing or similar, a bachelor’s degree (master’s preferred), and proficiency in SPC/DOE and device testing (I‑V, C‑V).

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