Plating Manufacturing Engineer (51381)

Headway Technologies; Milpitas (CA); On-site; USD 121,000 - 160,000; Full time

Job summary

Headway Technologies is seeking a Plating Manufacturing Engineer in Milpitas, CA to oversee day-to-day plating operations, including electroplating, resist stripping, and wet etching. The role focuses on improving yield, reducing costs, and implementing robust processes with data-driven analyses.

The position requires 1–3 years in semiconductor manufacturing or similar, a bachelor’s degree (master’s preferred), and proficiency in SPC/DOE and device testing (I‑V, C‑V).

Qualifications

• Bachelor’s degree in a relevant field; Master’s degree preferred.
• 1–3 years hands-on experience in magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role.
• Strong experience using semiconductor device testing (I‑V, C‑V, M‑H hysteresis) and magnetoresistivity.
• Hands-on experience in SPC and Design of Experiments (DOE).
• Proficient in Microsoft Office applications.

Responsibilities

• Monitors, sustains, and supports day-to-day plating manufacturing processes.
• Provides technical support to operators, technicians, and engineers for process reliability.
• Collaborates with development team on new plating process integration and optimizations; may lead projects.
• Analyzes data, runs experiments, and researches cost-saving methods to reduce scrap.
• Designs experiments to verify process robustness and reports findings.
• Adheres to safety policies and maintains documentation and MPI’s.

Skills

SPC and DOE

Semiconductor device testing (I‑V, C‑V

Microsoft Office

Education

Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics

Master’s degree preferred

Tools

JMP

Excel

Job description

Job Details: Job Location: Milipitas, CA 95035, Position Type: Full Time, Education Level: 4 Year Degree, Salary Range: $121,000.00 - $160,000.00 Salary/year, Job Shift: Days, TITLE: PLATING MANUFACTURING ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, PLATING MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Director of Plating Manufacturing Engineering, the Plating Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day plating processes and programs on the manufacturing line, including developing and delivering strategies to improve and optimize processes in electroplating, resist stripping, and wet etching; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; analyzing data, creating reports, and making presentations to groups; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products in the manufacturing line; and reviewing, updating, and maintaining all documentation and MPI’s. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Monitors, sustains, and supports day-to-day plating manufacturing processes, programs, and activities in the electroplating, resist stripping, and wet etching areas
• Ensures process reliability by providing technical support to operators, technicians, and other engineers
• Collaborates with development team regarding new plating process integration and manufacturing process improvements; may act as project lead on more complicated integration or optimization initiatives
• Improves the efficiency of the plating process by analyzing data, conducting experiments, and researching alternative methods which reduce scrap
• Designs and conducts advanced experiments to verify process robustness; analyzes data and reports findings
• Develops and implements practices or methodologies which lower cost, increase yield, and improve operational efficiency
• Conducts root cause analysis and implements corrective action if required
• Researches and proposes methods for improving production yields via process/tool manufacturability optimization
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Qualifications: MINIMUM QUALIFICATIONS:

• Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s degree preferred
• One to three years of hands‑on experience working in the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role
• Strong experience using semiconductor device testing, including I-V, C-V, M‑H Hysteresis, and Magnetoresistivity
• Hands on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

The annual rate for this full‑time position is between $121,000.00-$160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.

Knowledge, Skills, and Abilities:

• Knowledge of plating techniques, including resist stripping, wet etching, and electroplating
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated critical thinking and analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem‑solving and trouble‑shooting skills
• Flexible and able to prioritize

WORKING CONDITIONS:

The Plating Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time‑to‑time to meet business or operational needs; may travel from building‑to‑building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.

*Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.