Plater

ITT Micro-Mode Products Inc; El Cajon (CA); On-site; USD 45,000 - 65,000; Full time

Job summary

ITT Micro-Mode Products Inc in El Cajon, CA seeks a Plater to perform production plating on high-precision RF connector components in the Electroplating Lab. This hands-on role involves cleaning, masking, racking, and operating plating baths, ensuring proper temperature, pH and current density.

Experience with gold and nickel plating is valued, along with routine wet-chemistry checks. You will maintain bath logs and document results with careful attention to detail, while complying with NADCAP

Qualifications

• High school diploma or equivalent required.
• 1–3 years of electroplating or metal finishing experience in a production environment preferred.
• Ability to follow detailed procedures in a regulated (AS9100/NADCAP) environment.
• Strong attention to detail and ability to work with small components.
• Basic math and documentation skills.

Responsibilities

• Perform electroplating operations on small, precision components (e.g., contacts, connector parts) using processes such as gold and nickel plating.
• Prepare parts for plating including cleaning, masking, racking, and fixturing.
• Operate and monitor plating baths, maintaining parameters such as temperature, pH, and current density (ASF).
• Conduct basic wet chemistry checks (e.g., titrations, pH) and make routine chemical additions per specifications.
• Inspect plated parts for coverage, thickness, and defects; identify and address basic process issues.
• Maintain production records, bath logs, and lot traceability in accordance with NADCAP and quality requirements.
• Follow all safety, environmental, and chemical handling procedures.

Skills

Attention to detail

Documentation

Following procedures

Small parts handling

Math basics

Education

High school diploma or equivalent

Job description

Plater

US-CA-El Cajon

US-CA-El Cajon-3026

Job ID: 2026-17676

# of Openings: 1

Category: Operations

Overview

The Plater in the Electroplating Lab performs production plating operations on highprecision RF connector components while maintaining proper chemical bath conditions. This role combines handson plating with routine wet chemistry control to ensure consistent coating quality and compliance with aerospace and NADCAP requirements.

Responsibilities

• Perform electroplating operations on small, precision components (e.g., contacts, connector parts) using processes such as gold and nickel plating
• Prepare parts for plating including cleaning, masking, racking, and fixturing
• Operate and monitor plating baths, maintaining parameters such as temperature, pH, and current density (ASF)
• Conduct basic wet chemistry checks (e.g., titrations, pH) and make routine chemical additions per specifications
• Inspect plated parts for coverage, thickness, and defects; identify and address basic process issues
• Maintain production records, bath logs, and lot traceability in accordance with NADCAP and quality requirements
• Follow all safety, environmental, and chemical handling procedures

Qualifications

• High school diploma or equivalent required
• 1–3 years of electroplating or metal finishing experience in a production environment preferred
• Working knowledge of plating processes and basic bath chemistry control
• Ability to follow detailed procedures in a regulated (AS9100/NADCAP) environment
• Strong attention to detail and ability to work with small components
• Basic math and documentation skills

Equal employment opportunity, including veterans and individuals with disabilities.

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