PCB Rework Technician

Mindlance; Cupertino (CA); On-site; USD 39,000 - 58,000; Full time

Job summary

Mindlance seeks a skilled PCB Rework Technician to join our hardware engineering team onsite in Sunnyvale, CA. You will perform precision micro-soldering, repair, and modification of SMT and Through-Hole assemblies under high-magnification microscopes.

You will work with 0201/01005 passives, BGA/QFN packages, and 0.4mm pitch ICs, following IPC-610 and IPC-7711/7721 standards, and support engineering changes on prototype boards, all in a fast-paced environment.

Qualifications

• Must have 3–5+ years in precision PCB rework and micro-soldering in electronics/manufacturing.
• IPC‑A‑610 and IPC‑7711/7721 certifications preferred (J‑STD‑001 a plus).
• Experience with readout of schematics, BOMs, and ECO documentation is required.

Responsibilities

• Micro-Soldering & Rework: precision hand soldering, desoldering, replacement on fine-pitch components (0201/01005, QFNs, BGAs, 0.4mm pitch ICs).
• BGA rework and inspection: use rework stations, align, verify joints via X-ray and inspection tools.
• PCB repair: trace repair, pad restoration, wire jumpers, ground plane repair.
• Inspection & QA: SMT PCBA inspection to IPC standards using high-magnification tools.
• Prototyping & Modifications: manual ECO changes on prototype boards.
• Equipment maintenance: calibrate soldering irons, hot-air stations, ESD-safe setup.
• Documentation: track rework history and defect logs in ERP/MES.

Skills

Microscope inspection

Micro-soldering

BGA/QFN rework

Schematic reading

ESD protocols

CAD/Altium

AOI/X-ray systems

High-rel experience

Tools

Allegro

Altium

Job description

Job Duration: 8-12 - month contract (Possibility for extension)

Job Location: Onsite Sunnyvale, CA

Details: Job Overview

• We are seeking a highly skilled PCB Rework Technician specializing in fine-pitch micro-soldering to join our hardware engineering team.
• In this role, you will be responsible for precise assembly, modification, replacement, and repair of complex Surface Mount Technology (SMT) and Through-Hole (TH) printed circuit board assemblies.
• You will work extensively under high-magnification microscopes to execute delicate micro-soldering procedures on high-density assemblies.

Key Responsibilities

• Micro-Soldering & Rework: Perform precision hand soldering, desoldering, component replacement, and rework on fine-pitch components (including 0201/01005 passives, QFNs, BGAs, WLCSPs, and ultra-fine pitch ICs).
• BGA Rework & Inspection: Operate BGA rework stations for component removal, reballing, site preparation, and alignment. Utilize X-ray inspection equipment to verify solder joint integrity, voiding, and alignment.
• PCB Repair: Execute advanced trace repair, pad restoration, wire jumper installation, and ground plane repair using micro-drilling and conductive adhesives/epoxies where necessary.
• Inspection & Quality Assurance: Inspect PCBA work using high-magnification stereomicroscopes and optical inspection tools in strict accordance with IPC-A-610 and IPC-7711/7721 standards.
• Prototyping & Modifications: Support engineering teams by performing manual ECO (Engineering Change Order) modifications, jumper wire additions, and component swaps on prototype boards.
• Equipment Maintenance: Maintain and calibrate precision soldering irons, hot‑air rework stations, preheaters, micro‑tweezers, and ESD‑safe workstation gear.
• Documentation: Track rework history, defect logs, and yield metrics in the ERP/MES system.
• Qualifications & Requirements
• Experience: Minimum 3–5+ years of hands‑on experience in precision PCB rework and micro‑soldering within an electronics manufacturing, hardware R&D, or repair environment.
• Certifications: Current or past IPC‑A‑610 and/or IPC‑7711/7721 certifications strongly preferred (J‑STD‑001 is a plus).

Technical Skills:

• Proficiency in working under continuous stereo microscope magnification.
• Expert‑level micro‑soldering skill using hot air tools, micro‑tweezers, thermal strippers, and specialized solder tips.
• Demonstrated capability to rework 0201/01005 components, BGA/QFN packages, and 0.4mm pitch ICs.
• Experience reading and interpreting engineering schematics, assembly drawings, bill of materials (BOM), and ECO documentation.
• Physical & Aptitude Requirements: Excellent manual dexterity, steady hands, strong spatial reasoning, and visual acuity for fine detail. Good communication skills and the ability to work in a fast‑paced engineering environment.
• ESD Knowledge: Deep understanding of Electrostatic Discharge (ESD) prevention protocols and safe handling of sensitive semiconductor components.

Preferred Qualifications

• Familiarity with basic hardware troubleshooting.
• Ability to use CAD/board viewing software (e.g., Allegro, Altium, or similar).
• Experience with automated optical inspection (AOI) or X‑ray inspection systems.
• Background in high‑reliability industries such as aerospace, medical device, defense, or automotive electronics.
• Familiarity with conformal coating removal and re‑application techniques.

EEO:

“Mindlance is an Equal Opportunity Employer and does not discriminate in employment on the basis of – Minority/Gender/Disability/Religion/LGBTQI/Age/Veterans.”