Solder Specialist

Xlr8 Ems; San Clemente (CA); On-site; USD 55,000 - 75,000; Full time

Job summary

Xlr8 Ems in San Clemente, CA is seeking a skilled Solder Rework Operator to perform precision soldering, rework, and repair of PCBA assemblies, including BGA rework and replacement, with emphasis on quality and reliability.

You will handle manual soldering, desoldering, pad preparation, reballing, inspection with AOI, X-ray, and magnification tools, follow IPC standards, and train junior operators.

Qualifications

• High school diploma or equivalent; formal soldering and rework training.
• IPC-A-610, J-STD-001, IPC-7711/7721 certifications preferred.
• 3–5 years hands-on soldering and rework in PCBA manufacturing.

Responsibilities

• Perform manual soldering, desoldering, and rework per IPC/standards.
• Execute BGA rework and replacement with proper heating and cleaning.
• Prepare pads, reball BGAs, and reinstall components.
• Inspect reworked joints with AOI, X-ray, and magnification tools.
• Document defect logs and corrective actions.

Skills

Soldering

Rework techniques

Fine-pitch components

Attention to detail

Troubleshooting

Education

High school diploma

IPC-A-610/J-STD-001/IPC-7711/7721 certifications

Tools

AOI inspection tools

X-ray inspection systems

Magnification inspection

Job description

Job description:

Position Overview

We are seeking a detail-oriented and highly skilled Solder Rework Operator to perform precision soldering, rework, and repair of Printed Circuit Board Assemblies (PCBA). The ideal candidate will be trained to applicable industry standards and have hands-on experience with Ball Grid Array (BGA) rework and replacement, ensuring assemblies meet stringent quality and reliability requirements.

Key Responsibilities

Perform manual soldering, desoldering, and rework of surface-mount and through-hole components in accordance with IPC and company standards.

Execute BGA rework and replacement, including:

Component removal using controlled heating methods.

Pad preparation and site cleaning.

Reballing and reinstallation of BGAs.

Profiling and inspection to ensure solder joint integrity.

Apply rework standards for solder joints, ensuring compliance with IPC-7711/7721 and IPC-A-610.

SMT (Surface Mount Technology) pad repairing damaged pads on a printed circuit board (PCB) by cleaning the area, removing the defective pad, and installing a new one using soldering and bonding techniques.

Conduct inspection and verification of reworked assemblies using AOI, X-ray, and magnification tools.

Support troubleshooting of soldering defects and collaborate with engineering teams to resolve issues.

Maintain accurate documentation of rework activities, including defect logs and corrective actions.

Follow ESD handling procedures and ensure compliance with safety and quality protocols.

Assist in training junior operators on soldering and rework techniques.

Qualifications & Experience:

Education/Training: High school diploma or equivalent; formal training in soldering and rework techniques.

Certifications: IPC-A-610, J-STD-001, and IPC-7711/7721 certification strongly preferred.

Experience:

Minimum 3-5 years of hands-on soldering and rework experience in PCBA manufacturing.

Proven expertise in BGA rework and replacement processes.

Skilled in soldering fine-pitch components, QFNs, BGAs, and other advanced packages.

Strong knowledge of soldering materials, fluxes, and rework equipment.

Familiarity with thermal profiling and controlled heating methods for rework.

Ability to read and interpret assembly drawings, work instructions, and technical documentation.

Excellent attention to detail and manual dexterity.

Strong problem-solving skills and ability to work independently or in a team environment.

Preferred Skills:

Experience with X-ray inspection systems for BGA verification.

Knowledge of conformal coating removal and reapplication during rework.

Familiarity with selective soldering and vapor phase reflow processes.

Understanding of root cause analysis and corrective/preventive action (CAPA) in soldering defects.