Precision PCB Rework Technician: Micro-Soldering Expert

Mindlance; Cupertino (CA); On-site; USD 39,000 - 58,000; Full time

Job summary

Mindlance seeks a skilled PCB Rework Technician to join our hardware engineering team onsite in Sunnyvale, CA. You will perform precision micro-soldering, repair, and modification of SMT and Through-Hole assemblies under high-magnification microscopes.

You will work with 0201/01005 passives, BGA/QFN packages, and 0.4mm pitch ICs, following IPC-610 and IPC-7711/7721 standards, and support engineering changes on prototype boards, all in a fast-paced environment.

Qualifications

• Must have 3–5+ years in precision PCB rework and micro-soldering in electronics/manufacturing.
• IPC‑A‑610 and IPC‑7711/7721 certifications preferred (J‑STD‑001 a plus).
• Experience with readout of schematics, BOMs, and ECO documentation is required.

Responsibilities

• Micro-Soldering & Rework: precision hand soldering, desoldering, replacement on fine-pitch components (0201/01005, QFNs, BGAs, 0.4mm pitch ICs).
• BGA rework and inspection: use rework stations, align, verify joints via X-ray and inspection tools.
• PCB repair: trace repair, pad restoration, wire jumpers, ground plane repair.
• Inspection & QA: SMT PCBA inspection to IPC standards using high-magnification tools.
• Prototyping & Modifications: manual ECO changes on prototype boards.
• Equipment maintenance: calibrate soldering irons, hot-air stations, ESD-safe setup.
• Documentation: track rework history and defect logs in ERP/MES.

Skills

Microscope inspection

Micro-soldering

BGA/QFN rework

Schematic reading

ESD protocols

CAD/Altium

AOI/X-ray systems

High-rel experience

Tools

Allegro

Altium

Job description

Mindlance seeks a skilled PCB Rework Technician to join our hardware engineering team onsite in Sunnyvale, CA. You will perform precision micro-soldering, repair, and modification of SMT and Through-Hole assemblies under high-magnification microscopes.

You will work with 0201/01005 passives, BGA/QFN packages, and 0.4mm pitch ICs, following IPC-610 and IPC-7711/7721 standards, and support engineering changes on prototype boards, all in a fast-paced environment.