PCB Mechanical Engineer — High-Density Board & System Integration

Advanced Micro Devices; Seattle (WA); On-site; USD 120,000 - 170,000; Full time

Job summary

AMD in Seattle seeks an experienced Mechanical Engineer to own board-level mechanical design for next-generation AI and HPC platforms. You will define features, ensure manufacturability, and balance mechanical, electrical and thermal constraints with cross-functional teams to enable robust system integration.

Based in Seattle, WA, you will work with electrical, thermal and manufacturing teams, support bring-up and validation, and contribute to design specs for high-density boards and interfaces.

Qualifications

• Experience with mechanical design of electronic assemblies and boards (high-density) is preferred.
• Strong fundamentals in structural support and component integration.
• Experience with tolerance stackup analysis.
• Proficiency with CAD tools for mechanical design.
• Ability to collaborate across electrical, thermal, manufacturing and reliability teams.

Responsibilities

• Define and own mechanical features for board-level designs.
• Collaborate with electrical, thermal and manufacturing teams.
• Support thermal solutions and heat sink/cold plate interfaces.
• Ensure designs are manufacturable and meet reliability requirements.
• Review 2D drawings and specifications.

Skills

PCB design

Mechanical design

Thermal management

Cross-functional collaboration

Finite element analysis

Board-level integration

Interconnect layout awareness

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

Creo

SolidWorks

Job description

AMD in Seattle seeks an experienced Mechanical Engineer to own board-level mechanical design for next-generation AI and HPC platforms. You will define features, ensure manufacturability, and balance mechanical, electrical and thermal constraints with cross-functional teams to enable robust system integration.

Based in Seattle, WA, you will work with electrical, thermal and manufacturing teams, support bring-up and validation, and contribute to design specs for high-density boards and interfaces.