PCB - Layout Engineer

Talent Software Services, Inc.; Boston (MA); On-site; USD 120,000 - 180,000; Full time

Job summary

Talent Software Services, Inc. in Boston, onsite, seeks a Senior PCB Layout Engineer with 10+ years of experience to drive complex HDI PCB and substrate layouts for cutting-edge optical communications products.

You will work directly with cross-functional teams to hit challenging schedules while ensuring quality and manufacturability. The role requires deep Cadence Allegro expertise, IPC/JEDEC familiarity, and a proven track record in high-density, fine-pitch designs, with a strong focus on DFMs

Qualifications

• Bachelor's degree or higher with 10+ years in PCB/ substrate layout.
• Expert Cadence Allegro PCB design proficiency.
• Extensive experience with high-density, HDI, fine-pitch BGA designs.
• Hands-on with complex multilayer substrates and power converters.
• Strong understanding of transmission line geometries.

Responsibilities

• Lead PCB/layout development for optical communication products.
• Collaborate with electrical, mechanical, thermal, and manufacturing teams.
• Ensure IPC conformance and fabrication readiness.
• Close DFMs with fabricators and vendors to meet tolerances.
• Deliver high-volume, reliable layouts under aggressive schedules.

Skills

Cadence Allegro

HDI PCB layout

Fine-pitch BGAs

Multilayer substrates

Microstrip/CPW

Power converter layout

DFM knowledge

IPC/JEDEC standards

Education

Bachelor's degree or equivalent certifications

Tools

Cadence SiP tools

Substrate layout techniques

Job description

Possible 3 Month CTH

Role name: PCB - Layout Engineer

Work Location: Boston, Massachusetts (Onsite)

Start date: Immediate availability.

Background check MANDATORY

Job Description:

• The ideal candidate has strong relevant and recent technical and hands-on background and be able is hit the ground running as an individual contributor
• Contribute to, or lead, PCB and package substrate layout development for leading-edge Optical communication products
• Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
• Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
• Work with PCB fabricators, and substrate vendors to close DFMs.

Minimum Requirements

• Bachelor's degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
• Expert-level proficiency with Cadence Allegro PCB design tools
• Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
• Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
• Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
• Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
• Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
• Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.

Highly Desired Skills

• Demonstrated experience with mSAP PCB layout design
• Demonstrated experience with layout design of state of art optical pluggable products (CFP2, QSFP-DD, OSFP)
• Proficiency in Cadence SiP tools and Substrate layout techniques
• Proficiency in layout of designs with Wire Bond components
• Strong understanding of PCB fabrication and assembly processes
• Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)