Hybrid PCB Layout Engineer – High‑Density, High‑Speed Optics

Experis Technology Group; United States; Hybrid; USD 120.000 - 180.000; Vollzeit

Benefits dieser Stelle

Hybrid work model

9-month contract

Zusammenfassung

ManpowerGroup’s client is seeking a PCB Layout Design Engineer to support high-density, high-speed PCB and substrate layouts for optical communications. You will work hybrid from Boston, contributing to designs compliant with IPC standards and collaborating with electrical, mechanical, thermal, and manufacturing teams.

The role requires 10+ years’ hands-on PCB/layout experience, Cadence Allegro expertise, and deep knowledge of HDI, micro-via, BGA, and DC-DC power layouts.

Qualifikationen

• Bachelor’s degree with 10+ years in PCB board or substrate layout.
• Expert Cadence Allegro PCB design skills.
• Experience with HDI, micro-via, sequential lamination and fine-pitch BGAs.
• Experience with multilayer substrates and high-density BGAs.
• Understanding of transmission line geometries and DC-DC layouts.

Aufgaben

• Lead or contribute to PCB and substrate layout development for optical products.
• Ensure layouts meet IPC standards and fabrication capabilities.
• Collaborate with cross-functional teams to deliver manufacturable designs.
• Work with fabricators and vendors to close DFM and yield risks.
• Support high-volume, high-reliability product delivery on tight schedules.

Kenntnisse

Cadence Allegro

High-density layout

High-speed PCB

HDI

Microvias

Fine-pitch BGA

Transmission lines

DC-DC layout

Ausbildung

Bachelor's degree in Electrical Engineering

Tools

Cadence Allegro

Jobbeschreibung

ManpowerGroup’s client is seeking a PCB Layout Design Engineer to support high-density, high-speed PCB and substrate layouts for optical communications. You will work hybrid from Boston, contributing to designs compliant with IPC standards and collaborating with electrical, mechanical, thermal, and manufacturing teams.

The role requires 10+ years’ hands-on PCB/layout experience, Cadence Allegro expertise, and deep knowledge of HDI, micro-via, BGA, and DC-DC power layouts.