PCB layout / PCB Design Engineer

Lancesoft; Maynard (MA); Sur place; USD 120 000 - 180 000; Plein temps

Résumé du poste

Lancesoft in Maynard, MA is seeking a senior PCB design engineer with 10+ years of experience for an onsite, six-month contract with potential extension.

The role focuses on developing PCB and substrate layouts for advanced optical communications, ensuring IPC compliance and manufacturability, and collaborating with cross-functional teams to resolve DFM issues. A Bachelor's degree and Cadence Allegro expertise are required.

Qualifications

• Bachelor’s degree or equivalent with 10+ years of experience.
• Expert proficiency in Cadence Allegro PCB design tools.
• Strong experience in high-speed, high-density PCB/substrate layouts (HDI, microvias).
• Knowledge of transmission-line geometries and PCB fabrication/DFM.

Responsabilités

• Develop PCB and substrate layouts for optical products.
• Ensure IPC standards and manufacturing capabilities.
• Collaborate with electrical, mechanical, SI/PI, thermal, and manufacturing teams.
• Resolve DFM issues with fabricators and substrate vendors.

Connaissances

High-speed PCB design

HDI and microvias

Sequential lamination

Fine-pitch BGA

Multilayer substrates

Transmission-line geometry

DFM and tolerances

Cross-functional collaboration

Formation

Bachelor's degree in EE or related

Outils

Cadence Allegro PCB design tools

Cadence SiP

Description du poste

Job Location - Maynard-MA – (Fully Onsite)

Project Duration - 6 months + Chances of its further extension

Experience Range - 10+ Years

Job Description -

Responsibilities

• Develop PCB and package substrate layouts for advanced optical communication products.
• Ensure compliance with IPC standards, design guidelines, and manufacturing capabilities.
• Collaborate with electrical, mechanical, SI/PI, thermal, and manufacturing teams.
• Work with fabricators and substrate vendors to resolve DFM issues.
• Bachelor’s degree or equivalent certification with 10+ years of relevant experience.
• Expert proficiency in Cadence Allegro PCB design tools.
• Strong experience in high-speed, high-density PCB and substrate layouts, including HDI, microvias, sequential lamination, and fine-pitch BGA.
• Experience with multilayer organic substrates and advanced component packages.
• Knowledge of transmission-line geometries, including microstrip, stripline, and CPW.
• Strong understanding of PCB fabrication, assembly, DFM, and manufacturing tolerances.

Preferred Skills

• Experience with mSAP PCB layout and optical pluggable products (CFP2, QSFP-DD, OSFP).
• Proficiency in Cadence SiP and package substrate layout.
• Experience with wire-bond components.
• Knowledge of IPC Class 2/3, JEDEC, and other relevant industry standards.