Lead/Principal Semiconductor Packaging Engineer - 843

Entangled Future; Town of Malta (NY); On-site; USD 180,000 - 240,000; Full time

Job summary

Quantinuum Malta, NY seeks a Lead/Principal Semiconductor Packaging Engineer to drive advanced packaging for ion trap chips in a full-time role on-site. You will lead cross-functional teams, set packaging requirements, and collaborate with vendors to deliver reliable, scalable packaging solutions for quantum hardware.

The role emphasizes expertise in 2.5D/3D packaging, photonic integration, and high-density interconnects, with a track record in IP generation.

Qualifications

• PhD in Physics or Engineering.
• Experience with advanced large area multi-chip packaging technologies.
• Experience with large heterogeneous integration.
• Experience with high-density I/O technologies.
• Experience with photonic packaging and fiber-to-chip coupling.
• Proven track record of IP development and innovation.
• Experience working within a cross-functional team environment.

Responsibilities

• Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together.
• Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density.
• Generate packaging requirements for mechanical, thermal, electrical, and optical performance.
• Lead a team working with vendors to implement and validate packaging processes.
• Support all stages of ion trap development to ensure compatibility with packaging.
• Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements.
• Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities.

Skills

Large area multi-chip packaging

Large heterogeneous integration

High-density I/O technologies

Photonic packaging

Fiber-to-chip coupling

Cross-functional teamwork

IP development

Education

PhD in Physics or Engineering

Bachelor’s or Master’s degree with significant experience

Job description

Lead/Principal Semiconductor Packaging Engineer - 843 at Quantinuum, US Malta, NY. A lead-level full time position in the Quantum Computing Hardware team, listed under hardware engineering.

We are seeking an experienced Lead/Principal Semiconductor Packaging Engineer to work on a supplier site in Malta, NY as a full time Quantinuum employee developing innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers.

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

WE VALUE

• PhD in Physics or Engineering
• Experience with advanced large area multi-chip semiconductor packaging technologies
• Experience with large heterogeneous integration
• Experience with high-density I/O technologies
• Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling
• A proven track record of innovation and IP development
• Experience working within a cross-functional team environment

Quantinuum is a leading quantum computing company delivering a full stack platform designed to make quantum computing deployable in real-world environments. With active engagements spanning pharmaceuticals, material science, financial services, government, industrial sectors, and leading academic and research institutions worldwide, we are helping organizations unlock the transformative potential of quantum computing.

Our global team of more than 800 employees includes many of the world's leading scientists, engineers, and researchers, with more than 70% of our technology team holding advanced degrees at the Master's or PhD level. Headquartered in Broomfield, Colorado, Quantinuum operates across the United States, United Kingdom, Germany, Japan, and Singapore.

By joining Quantinuum, you'll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible.

What's in it for you?

We believe our people are our greatest strength and offer a comprehensive rewards package that supports your professional growth, well-being, and long-term success.

Responsibilities

• Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
• Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density
• Generate packaging requirements for mechanical, thermal, electrical, and optical performance
• Lead a team working with vendors to implement and validate packaging processes
• Support all stages of ion trap development to ensure compatibility with packaging
• Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
• Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities

Requirements

• Minimum Bachelor’s degree with 10+ years’ experience OR Master’s degree with 8+ year’s experience OR PhD with 6+ year’s experience in advanced semiconductor packaging development
• Experience with 2.5-3D packaging techniques
• Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.