Packaging Engineer Intern - Spring 2027, Hands-on

Printpack; Atlanta (GA); On-site; USD 25,000 - 33,000; Full time

Benefits offered by this job

Housing stipend

Competitive compensation

Job summary

Printpack, headquartered in Atlanta, GA, invites applications for a Packaging Engineer Intern for Spring 2027 (Jan 2027–Jun 2027). Based in Atlanta, this full‑time internship offers hands‑on experience with product development and manufacturing teams to design next‑generation packaging.

The program provides housing stipend, competitive compensation, and exposure to leading consumer brands. Candidates pursuing BS Packaging or related field with GPA 3.0+ are encouraged to apply.

Qualifications

• Pursuing a BS in Packaging or related technical field.
• GPA of 3.0 or above.

Responsibilities

• Coordinate and manage activities including specification consolidation, packaging materials performance criteria, sample fabrication, and prototyping.
• Provide support to Manufacturing by implementing standard operating procedures on equipment and supporting development trials.
• Conduct basic research on new technologies.
• Interact with Sales, Marketing, and Technical associates on various product platforms and market development initiatives.
• Facilitate Product Development/Marketing innovation sessions by organizing, completing pre‑work or research, and following up on actions items created.

Education

Bachelor of Science in Packaging or related field

GPA of 3.0 or above

Job description

Printpack, headquartered in Atlanta, GA, invites applications for a Packaging Engineer Intern for Spring 2027 (Jan 2027–Jun 2027). Based in Atlanta, this full‑time internship offers hands‑on experience with product development and manufacturing teams to design next‑generation packaging.

The program provides housing stipend, competitive compensation, and exposure to leading consumer brands. Candidates pursuing BS Packaging or related field with GPA 3.0+ are encouraged to apply.