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NVIDIA in Oregon is seeking a Senior Package Layout Engineer to contribute to high-speed, high-density ASIC packaging. You will collaborate with the Layout team to implement substrate breakout patterns, optimize pinouts, and support routing, placement, and power distribution using Cadence APD or SiP tool suites.
Required are a B.S. in Electrical Engineering and 2+ years of PCB layout experience on graphics cards or motherboards (HDI a plus).
NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!
NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you.
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 108,000 USD - 184,000 USD.
You will also be eligible for equity and benefits.
NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.