Yield Analysis Engineer — Root-Cause Lab

Intel; Hillsboro (OR); On-site; USD 99,000 - 140,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Job summary

Intel in Hillsboro, Oregon seeks an experienced LYA Engineer to support back-end package assembly and wafer-level testing. You will perform design, test, and characterization of wafer level assembly technologies, and coordinate across teams to drive root-cause analysis.

Requires a Master’s or higher in Materials Science or related field with lab experience; preferred knowledge of SEM, X-ray, TEM, FIB, and data analysis tools; strong communication and collaboration in a fast-paced, on-site

Qualifications

• Master's degree or higher in a relevant engineering/science field with lab experience.
• At least 1 year of lab experience with defect characterization or electrical fault isolation techniques.
• Experience with packaging and semiconductor assemblies is a plus.

Responsibilities

• Coordinate across team boundaries to meet program milestones and deliverables.
• Interface with internal teams and external suppliers to improve yield and drive innovation.
• Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions.
• Develop failure analysis techniques and approaches to accelerate identification of root causes.

Skills

Analytical thinking

Problem solving

Communication

Cross-functional collaboration

Ambiguity tolerance

Education

Master's degree in Materials Science and Engineering

Master's or higher in related field

Tools

SEM

X-ray

TEM

FIB

Cross-sectioning

EDX

SQL scripting

Statistical analysis (JMP)

Job description

Intel in Hillsboro, Oregon seeks an experienced LYA Engineer to support back-end package assembly and wafer-level testing. You will perform design, test, and characterization of wafer level assembly technologies, and coordinate across teams to drive root-cause analysis.

Requires a Master’s or higher in Materials Science or related field with lab experience; preferred knowledge of SEM, X-ray, TEM, FIB, and data analysis tools; strong communication and collaboration in a fast-paced, on-site