Failure Analysis & Probing Engineer (TEM/SEM/FIB)

Intel; Phoenix (AZ); On-site; USD 95,000 - 135,000; Full time

Job summary

Intel in Phoenix, Arizona is seeking a Manufacturing Failure Analysis Engineer to ensure the reliability of silicon devices and packages. You will perform probing, analysis, and root‑cause investigations to support yield improvements.

The role requires hands-on experience with TEM, SEM, FIB, and probe stations, strong data interpretation, and collaboration with FA engineers to optimize test flows and lab practices. US citizenship and the ability to obtain security clearance are required.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields.
• 2+ years of hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation in a lab or applications setting OR 2+ years in a lab setting where samples are prepared for analysis.
• US citizenship required.
• Ability to obtain and maintain a US Government Security Clearance.

Responsibilities

• Operate general failure analysis tools in labs (TEM, SEM, optical scopes).
• Perform electrical probing and advanced characterization on silicon devices (wafer-level and site-specific structures).
• Set up, operate, and troubleshoot probe stations and electrical measurement systems.
• Execute complex test plans and interpret schematics, layouts, and device structures to support failure analysis workflows.
• Analyze electrical data (IV, CV, leakage, shorts/opens) to support fault isolation and root cause identification.
• Partner with FA engineers to integrate probing with SEM, FIB/PFIB, TEM-based workflows.
• Drive improvements in probing methods, workflows, and BKMs.
• Provide technical guidance to junior engineers and technicians on probing techniques and lab practices.
• Support tool ownership activities including troubleshooting, calibration, and uptime improvement.
• Participate in lab sustaining, process transfer, and cross-functional yield improvement initiatives.

Education

Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields

Tools

TEM

SEM

FIB

Nanoprobing

Job description

Intel in Phoenix, Arizona is seeking a Manufacturing Failure Analysis Engineer to ensure the reliability of silicon devices and packages. You will perform probing, analysis, and root‑cause investigations to support yield improvements.

The role requires hands-on experience with TEM, SEM, FIB, and probe stations, strong data interpretation, and collaboration with FA engineers to optimize test flows and lab practices. US citizenship and the ability to obtain security clearance are required.