Optomechanical Engineer: Laser Micromachining for Packaging

Atomic Semi; Austin, Northern (TX, KY); Hybrid; USD 130,000 - 180,000; Full time

Benefits offered by this job

Medical insurance

Dental & Vision insurance

Visa sponsorship

Paid time off

401(k)

Job summary

fab2 in Austin is seeking a hands‑on Optomechanical Engineer to develop the full set of tools and processes for semiconductor packaging devices, from concept through operation.

You will own optomechanical system design, laser micromachining processes, and collaboration with process, mechanical, electrical, controls, and software engineers to deliver reliable, manufacturable hardware.

Fab2 offers a competitive total compensation package, including salary in the $130,000–$180,000 range and equity.

Qualifications

• Hands-on experience designing, building, integrating, or modifying process equipment or scientific instruments.
• Experience with optomechanical system design, including mechanical design, optics, precision assembly, wiring, controls, and alignment.

Responsibilities

• Own optomechanical system development from concept through operation, including mechanical design, optical layout, assembly, wiring, controls, alignment and debugging.
• Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
• Create and validate novel IC packaging processes from experimentation to repeatable multi-step flows.
• Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging steps.
• Collaborate with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
• Maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements.

Skills

Optomechanical design

Laser micromachining

System integration

Metrology & failure analysis

Independent R&D work

Job description

fab2 in Austin is seeking a hands‑on Optomechanical Engineer to develop the full set of tools and processes for semiconductor packaging devices, from concept through operation.

You will own optomechanical system design, laser micromachining processes, and collaboration with process, mechanical, electrical, controls, and software engineers to deliver reliable, manufacturable hardware.

Fab2 offers a competitive total compensation package, including salary in the $130,000–$180,000 range and equity.