Micro Assembler B: Die & Wire Bonding Specialist (Onsite)

Data Device Corporation; Bohemia (NY); On-site; USD 33,000 - 39,000; Full time

Job summary

Power Device Corporation (DDC) in Bohemia, NY is seeking a Micro Assembler B to perform moderately complex assembly operations with increased independence, including die bonding, wire bonding, and header assembly, while reading detailed drawings and guiding less experienced team members.

The role focuses on quality and productivity, with mentoring responsibilities and collaboration with supervisors to address issues and improve processes.

Qualifications

• 3+ years of micro-assembly or related work experience.
• Strong manual dexterity and ability to work with small components.
• Ability to interpret complex assembly drawings and documentation.
• Experience with die bonding, wire bonding, and header assembly.
• Good problem-solving skills and ability to work independently.
• Ability to train and mentor less experienced team members.

Responsibilities

• Perform a variety of assembly operations, including die bonding, wire bonding, header assembly, and other complex operations, under minimal supervision.
• Use small hand tools, microscopes, and other automated equipment to complete assembly tasks.
• Read and interpret detailed assembly drawings and documentation to ensure correct procedures and sequences are followed.
• Mentor and assist junior team members (Micro Assembler C) to develop skills and meet department goals.
• Conduct regular quality checks and troubleshooting of assemblies.
• Actively contribute to meeting department production goals and quality standards.
• Communicate effectively with supervisors and team leads to address issues and improve processes.

Skills

Micro-assembly

Die bonding

Wire bonding

Header assembly

Reading assembly drawings

Mentoring junior staff

Problem solving

Independence

Job description

Power Device Corporation (DDC) in Bohemia, NY is seeking a Micro Assembler B to perform moderately complex assembly operations with increased independence, including die bonding, wire bonding, and header assembly, while reading detailed drawings and guiding less experienced team members.

The role focuses on quality and productivity, with mentoring responsibilities and collaboration with supervisors to address issues and improve processes.