NPI Packaging Engineer Intern – Fall 2026

Murata Manufacturing Co., Ltd.; San Diego (CA); On-site; USD 44,000 - 80,000; Full time

Job summary

pSemi Corporation, a Murata company, is seeking an Intern NPI Packaging Engineer for Fall 2026 in San Diego, CA. The role supports RFIC product design and prototype assembly during development, requiring collaboration and urgency to meet schedule.

You will help design bump/package flows, prepare BOMs, and execute DoE experiments while supporting failure analysis in a fast-paced environment.

Qualifications

• Hands-on experience with design tools such as AutoCAD.
• Familiarity with DOE methodology.
• Ability to present technical information to technical personnel.
• Demonstrated ability to collect accurate experimental data, basic data analysis and plotting for presentation to others.
• Basic understanding of robot machinery.

Responsibilities

• Participates with design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications and will use data analysis to drive most decisions.
• Prepares design documentation and bill of materials for both chip fabrication, backend wafer processes, and component assembly.
• Execution of DoE experiments collecting characterization data to substantiate design decisions and mitigate technical risk to new products in development.
• Supports failure analysis and problem resolution in the development process or production environment.

Skills

DOE methodology

Data analysis

Present technical information

Basic robot machinery understanding

Education

Bachelor’s degree in Mechanical Engineering or Materials Science (in progress)

MSME candidate

Tools

AutoCAD

Job description

pSemi Corporation, a Murata company, is seeking an Intern NPI Packaging Engineer for Fall 2026 in San Diego, CA. The role supports RFIC product design and prototype assembly during development, requiring collaboration and urgency to meet schedule.

You will help design bump/package flows, prepare BOMs, and execute DoE experiments while supporting failure analysis in a fast-paced environment.