Intern, NPI Packaging Engineer - Fall 2026

Murata Manufacturing Co., Ltd.; San Diego (CA); On-site; USD 44,000 - 80,000; Full time

Job summary

pSemi Corporation, a Murata company, is seeking an Intern NPI Packaging Engineer for Fall 2026 in San Diego, CA. The role supports RFIC product design and prototype assembly during development, requiring collaboration and urgency to meet schedule.

You will help design bump/package flows, prepare BOMs, and execute DoE experiments while supporting failure analysis in a fast-paced environment.

Qualifications

• Hands-on experience with design tools such as AutoCAD.
• Familiarity with DOE methodology.
• Ability to present technical information to technical personnel.
• Demonstrated ability to collect accurate experimental data, basic data analysis and plotting for presentation to others.
• Basic understanding of robot machinery.

Responsibilities

• Participates with design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications and will use data analysis to drive most decisions.
• Prepares design documentation and bill of materials for both chip fabrication, backend wafer processes, and component assembly.
• Execution of DoE experiments collecting characterization data to substantiate design decisions and mitigate technical risk to new products in development.
• Supports failure analysis and problem resolution in the development process or production environment.

Skills

DOE methodology

Data analysis

Present technical information

Basic robot machinery understanding

Education

Bachelor’s degree in Mechanical Engineering or Materials Science (in progress)

MSME candidate

Tools

AutoCAD

Job description

Intern, NPI Packaging Engineer - Fall 2026

Location

San Diego, CA, US

pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world‑class capabilities with high‑performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

Job Summary

This position assists with design and prototype assembly of new RFIC products during the product development phase. This position must enjoy working in a fast‑paced environment while maintaining a sense of commitment and be flexible to project needs. We are looking for a collaborative team member who possesses a sense of urgency to meet product requirements on schedule.

This position has responsibility for:

• Participates with design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications and will use data analysis to drive most decisions.
• Prepares design documentation and bill of materials for both chip fabrication, backend wafer processes, and component assembly.
• Execution of DoE experiments collecting characterization data to substantiate design decisions and mitigate technical risk to new products in development.
• Supports failure analysis and problem resolution in the development process or production environment.

Minimum Qualifications (Experience and Skills)

• Hands on experience with design tools such as AutoCAD.
• Familiarity with DOE methodology.
• Ability to present technical information to technical personnel.
• Demonstrated ability to collect accurate experimental data, basic data analysis and plotting for presentation to others.
• Basic understanding of robot machinery.

Preferred Qualifications

• Hands on experience with manufacturing equipment and processing.
• Excellent verbal and written communication skills.
• Strength in documentation clarity and completeness.
• Cooperative team member with a strong sense of urgency to meet product requirements on schedule.
• Willingness to go beyond what’s required.

Education Requirements

• Fulltime enrollment in accredited Bachelor’s degree program in Mechanical Engineering, Materials Science Engineering or equivalent (must be completing 3+ year) or MSME candidate

This job operates in a professional office environment. This role routinely uses standard office equipment.

Physical Demands

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.

USD 32.20 - 58.32 per hour

Thank you for your interest in our temporary position. Please be advised that the selected candidate will be employed and receive all wages directly from a third party staffing agency selected by pSemi.

pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver’s license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including “protected veterans” under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. Note: The Peregrine Semiconductor name, Peregrine Semiconductor logoand UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP andDuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: http://patents.psemi.com