NAND Product Development Enginneer

Solidigm

Sacramento (CA)

On-site

USD 95,000 - 116,000

Full time

8 days ago
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Job summary

Solidigm in Sacramento is seeking an experienced NAND component test engineer to lead production introduction and set up test strategies for qualification. You will drive yield improvement during NPI and HVM sustaining and work closely with cross-functional teams.

You will develop burn-in and high-speed I/O test specs, validate test code, review data, and support tape releases. Strong communication and leadership are essential.

Qualifications

  • Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.
  • 5+ years of experience in logic/memory product engineering or test engineering.
  • Knowledge of NAND Flash memory technology, including architecture and operation.
  • Familiar with burn-in and high-speed I/O test platforms and architectures.
  • Excellent communication and teamwork abilities in a multi-disciplinary environment.
  • Proven track record of technical leadership and ability to work independently.

Responsibilities

  • Develop, validate, and deploy burn‑in and high‑speed I/O test specifications, methodologies, and test flows for NAND components on high‑volume platforms.
  • Partner with test development engineers to validate test code, review data, and tape release plan.
  • Communicate key component test information with cross‑functional stakeholders including yield projections.
  • Analyze component test and manufacturing data to identify yield trends and improvement opportunities.
  • Collaborate with design, process, and reliability teams to troubleshoot test issues and optimize methodologies.

Skills

Statistical data analysis
Test engineering
NAND Flash knowledge
Burn-in test
Data analysis

Education

Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.

Tools

NAND test platforms
Burn-in equipment
Electrical failure analysis tools

Job description

Job Description

Experienced engineer familiar with NAND component test, he will responsible for new generation NAND production introduction, setup component test strategy to support product qualification. lead yield improvement during NPI and HVM sustaining.

Major responsibilities include:
  1. Develop, validate, and deploy burn‑in and high‑speed I/O test specifications, methodologies, and test flows for NAND flash components across high‑volume manufacturing platforms.
  2. Partner closely with test development engineers to ensure robust assessment of test code validation plan, check out data review and tape release plan.
  1. Communicate key component test information with cross‑functional stakeholders including yield roadmap/projection, test coverage etc

  2. Analyze component test and manufacturing data to identify yield trends, anomalies, and opportunities for product, process, or test improvement.

  3. Collaborate with design, process, and reliability teams to troubleshoot complex test issue and optimize test methodologies to improve coverage, efficiency, and cycle time while supporting yield enhancement and failure analysis activities.

Qualifications:

Qualifications

Minimum Qualifications:
  1. Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.

  2. 5+ years of experience in logic/memory product engineering or test engineering. Proficient in statistical data analysis and electrical failure analysis to segment and determine root cause of test failures.

  3. Knowledge of NAND Flash memory technology, including architecture and operation.

  4. Functional knowledge of burn‑in and high speed I/O test platforms and architectures.

  5. Excellent communication and teamwork abilities, with experience working in a multi‑disciplinary engineering environment.

  6. Proven track record of technical leadership and ability to work independently.

Preferred Qualifications:

10+ years of experience in memory product/test engineering, with majority of it in NAND Flash.

Additional Information

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Compensation:

$105,440-$105,440 per year

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