Module Engineer On-Shift (MEOS) - Night Shift (4)

Intel; Phoenix (AZ); On-site; USD 65,000 - 90,000; Full time

Job summary

Intel Corporation's Substrate Packaging Technology Development (SPTD) is seeking a Module Engineer On Shift (MEOS) to join our Chandler facility in Arizona. You will support 24x7 manufacturing, troubleshoot equipment and process issues, and ensure continuous lot movement on the production line.

This entry-level role offers hands-on floor exposure, cross‑functional collaboration with engineers and technicians, and opportunities to contribute to next‑gen semiconductor packaging while developing

Qualifications

• Bachelor's degree in materials/ mechanical/ chemical engineering, physics, or related discipline with 1+ years of relevant industry experience, or a Master's degree.
• This position is entry level and not eligible for Intel immigration sponsorship.
• Preferred qualifications include 1+ years applying Statistical Process Control (SPC) methodologies in manufacturing.
• Hands-on experience in semiconductor packaging or packaging substrate manufacturing.

Responsibilities

• Provide hands-on, real-time floor support for equipment, process, and product issues to maintain 24x7 flow.
• Receive and deliver shift pass-downs; align priorities with management at shift start.
• Troubleshoot process issues, perform error recovery, manage lot disposition and tool enablement.

Skills

Problem-solving

Clear communication

Adaptability

Self-motivation

Team-oriented

Education

Bachelor's degree in materials/ mechanical/ chemical engineering

Master's degree in materials/ mechanical/ chemical engineering

Job description

Job Details:

Job Description:

Intel Corporation is one of the world's leading semiconductor companies, dedicated to creating technology that changes the world. From powering the cloud to enabling AI, autonomous vehicles, and next-generation computing, Intel's innovations touch nearly every aspect of modern life. With a culture built on curiosity, collaboration, and a relentless drive to push boundaries, Intel offers engineers the opportunity to do the most meaningful work of their careers.

Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a critical part of Intel's advanced manufacturing ecosystem, the SPTD team is driving the future of semiconductor packaging - and we're looking for talented engineers to help us get there.

We are seeking a motivated and technically skilled Module Engineer On Shift (MEOS) to join our SPTD team at our state-of-the-art facility in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time support to ensure seamless lot movement through the production line. You'll work directly on the factory floor, solving complex equipment and process challenges, and collaborating with a talented team of engineers and technicians.

Shift 4 Details:

Hours: 6:00 PM - 6:00 AM (Night Shift)

Schedule: Alternating 3- and 4-day work weeks (Sunday-Tuesday, with alternating Saturdays) - giving you more days off than a traditional 5-day schedule!

This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience.

Key Responsibilities:

• Factory Floor Support: Provide hands‑on, real‑time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line.
• Shift Communication: Receive written and verbal pass‑downs from outgoing shift peers; deliver comprehensive, quality pass‑downs to incoming shift teams; align priorities with management at the start of each shift.
• Troubleshooting & Error Recovery: Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.
• Documentation: Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records.
• Inspection & Imaging: Execute non‑standard procedures and perform inspection and imaging on panels to collect critical development data.
• Stakeholder Communication: Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency.
• Ad‑Hoc Support: Perform a variety of ad‑hoc duties as required by the factory within your specific functional area.

As a Successful Candidate, You Will Bring:

• Strong problem‑solving instincts - you approach challenges with curiosity and persistence
• Clear and confident communication - you can articulate complex issues clearly to peers, engineers, and stakeholders
• Adaptability - you thrive in a dynamic environment and can pivot quickly when priorities shift
• Self‑motivation and initiative - you take ownership of your work and don't wait to be told what to do next
• Team‑oriented mindset - you support your colleagues and contribute to a positive, collaborative shift culture

If you're ready to work on technology that matters - and join a team that's shaping the future of semiconductor packaging - we'd love to hear from you.

Qualifications:

This is an entry level position. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

• Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline with 1+ years of relevant industry experience OR
• Master's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline

Preferred Qualifications:

• 1+ years of experience: Applying Statistical Process Control (SPC) methodologies in a manufacturing environment
• Hands‑on experience in Semiconductor Packaging or Packaging Substrate Manufacturing

Job Type:

Experienced Hire

Shift:

Shift 4 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious