Module Engineer On Shift (MEOS)

Intel Corporation; Phoenix (AZ); Presencial; USD 85 000 - 120 000; Tempo integral

Resumo da oferta

Intel Corporation's Epoxy MEOS team in Arizona seeks a Packaging Module Development Engineer to advance assembly and packaging processes for next-generation semiconductor products. You will design and optimize packaging solutions, applying SPC and DOE to ensure quality, reliability, cost, yield, and manufacturability.

You will collaborate with suppliers and cross-functional teams in a fast-paced environment, contributing to meaningful projects while growing your technical expertise in a leading

Qualificações

• Bachelor's degree in engineering with 2+ years in assembly and packaging technologies.
• Experience in mechanical packaging processes and related equipment.
• Familiarity with SPC/DOE principles and packaging quality controls.

Responsabilidades

• Design and develop assembly packaging processes and equipment for next-generation technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, and manufacturability goals.
• Apply SPC and DOE to refine process and equipment specs.
• Test packaging against simulated field conditions to evaluate performance.
• Oversee packaging process lifecycle and ensure quality standards.

Conhecimentos

Curiosity

Collaboration

Problem-solving

Attention to detail

Communication

Adaptability

Ownership

Formação académica

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Materials Science

Bachelor's degree in Electrical/Applied Technology

Ferramentas

DOE methods

SPC methods

Descrição da oferta de emprego

Job Details

Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With decades of engineering excellence and a commitment to pushing the boundaries of what's possible, Intel develops the technologies that power everything from personal devices to data centers and AI systems. At Intel, we believe in the power of human ingenuity - and we're looking for bold, curious minds to help us build what's next.

Are you passionate about semiconductor innovation and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at the forefront of developing and optimizing cutting-edge assembly and packaging processes that directly influence the quality, reliability, and performance of Intel's next-generation semiconductor products.

This is an exciting opportunity for an early-career engineer who is eager to apply their academic knowledge in a world-class manufacturing and engineering environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.

Shift Information

This role operates on Shift 4: 6:00 PM - 6:00 AM on an alternating weekly schedule: (nights frontend) Sun-Tues and alternating Saturday nights

Key Responsibilities

• Design and develop assembly packaging processes and equipment to enable next-generation semiconductor technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to create and refine process and equipment specifications.
• Conduct tests under simulated field conditions - including heat, humidity, and dynamic forces - to evaluate silicon and package technologies.
• Oversee the manufacturability of package designs and manage the full lifecycle of packaging processes, procedures, and workflows.
• Collaborate with suppliers and procurement teams to establish material specifications and ensure compliance with quality and performance standards.
• Develop innovative techniques, tools, and quality screens to identify packaging quality and reliability issues early in the development cycle.
• Set reliability standards based on a deep understanding of failure mechanisms, influencing design, material selection, and process development.
• Provide technical consultation and support for packaging process improvements while responding to internal customer and client needs.
• Drive standardization in product qualification, manufacturing quality systems, and engineering practices, ensuring alignment with key product milestones.

As a Successful Candidate, You Will Bring

• Curiosity & Eagerness to Learn - You have a growth mindset and are always looking to deepen your knowledge and skills.
• Collaborative Spirit - You thrive in cross-functional team environments and build strong working relationships with colleagues, suppliers, and stakeholders.
• Problem-Solving Mindset - You approach challenges analytically and creatively, finding solutions even in ambiguous situations.
• Attention to Detail - You take pride in precision and accuracy, especially when working with complex processes and specifications.
• Effective Communication - You can clearly articulate technical concepts to both technical and non-technical audiences.
• Adaptability - You are comfortable navigating a fast-paced, dynamic environment and can manage shifting priorities with ease.
• Ownership & Accountability - You take initiative, follow through on commitments, and hold yourself to a high standard of quality.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

• Bachelor's degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field with 2+ years of hands-on experience in any of the following Assembly and packaging technologies
• Technology Manufacturing

Preferred Qualifications

• 2+ years of experience in: Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Laser, optical systems, or s