Module Development Engineer (Ph.D.) - Intel Foundry

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation and retirement programs

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to drive development, optimization, and high-volume manufacturing transfer of advanced semiconductor processes.

You will work across lithography, etch, deposition, and metrology, applying DOE, statistical modeling, and data analytics to reduce variability and improve yield while collaborating with external tool vendors and internal teams for robust technology transfer.

Qualifications

• Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or related STEM field (expected completion prior to start date).
• 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology.
• 6+ months in a cleanroom or semiconductor research lab working with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).
• Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software for data analysis and automation.
• Device Physics & Integration: specialization in transistor architecture or FEOL/BEOL process integration.

Responsibilities

• Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.
• Apply statistical modeling, DOE, and control systems to reduce variability and drive yield enhancement.
• Partner with external tool/material suppliers and internal integration teams to co-develop equipment and process methodologies.
• Resolve equipment, process, and yield excursion root causes to ensure smooth technology transfer from development into high-volume manufacturing.
• Document experimental findings and technical recommendations through reports and presentations.

Skills

Semiconductor fabrication

Statistical modeling

DOE

SPC

Data analysis

Education

Ph.D. in Electrical Engineering or related STEM

Tools

Python

MATLAB

JMP

C#

Job description

Job Details:Job Description:About the RoleIntel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of Intel architecture.As a Module Development Engineer , you will drive the development, optimization, characterization, and high-volume manufacturing (HVM) transfer of leading-edge semiconductor processes.Patterning & Removal: Lithography, Overlay, Wet Etch, Dry/Plasma Etch, Chemical Mechanical Planarization (CMP).Thin Films & Doping: Epitaxy (EPI), Thin-Film Deposition (ALD/CVD/PVD), Diffusion, Ion Implantation, Metals/Metallization, Dielectrics.Metrology, Yield & Integration: In-line Metrology, FEOL/BEOL Process Integration, Defect Reduction, Yield Analysis, Electrical Characterization.Key Responsibilities (\"What You Will Do\")Process & Hardware Engineering: Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.Process Control & Data Analytics: Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability, mitigate defects, and drive yield enhancement.Cross-Functional & Vendor Collaboration: Partner with external tool/material suppliers and internal integration teams to co-develop cutting-edge equipment and process methodologies.HVM Technology Transfer: Resolve equipment, process, and yield excursion root causes to ensure smooth, robust technology transfer from development into high-volume manufacturing.Documentation & Technical Reporting: Document experimental findings, operating procedures, and technical recommendations through engineering reports and presentations.Qualifications:Candidates must meet the following criteria (relevant experience may be gained through academic coursework, laboratory research, thesis work, internships, post doc, or publications):Minimum QualificationsEducation: Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or a related STEM field (expected completion prior to start date).Hands-on Experience: 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology, including one or more of the following: lithography (Litho)/overlay, epitaxy (EPI), wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization.Preferred QualificationsEnvironment & Tooling: 6+ months in a cleanroom or semiconductor research lab working directly with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software/scripting languages (Python, MATLAB, JMP, C#, or equivalents) for data analysis and automation.Device Physics & Integration: Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration.Technical Dissemination: Proven track record of presenting technical findings through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers.By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above.Job Type:Shift:Shift 1 (United States of America)Primary Location:US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.*Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.