Module Development Engineer - LTD Dry Etch

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Hybrid work model

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a seasoned engineer to drive next-generation dry etch patterning for high-volume manufacturing. You will own process development, run DOE studies, and partner with Process Integration, Manufacturing, and Equipment teams to deliver robust, scalable solutions.

The role requires hands-on expertise with plasma etch, defect analysis, and statistical methods; you will mentor peers and help shape the technology roadmap for leading logic devices.

Qualifications

• PhD or Master's with relevant industry or research experience.
• Hands-on experience in dry etch semiconductor manufacturing.
• Experience with plasma etch fundamentals and defect mechanisms.
• Experience delivering dry etch process solutions that improve yield or reliability.
• Expertise in statistical analysis and DOE methodologies.

Responsibilities

• Drive technology development for future technology and high-volume manufacturing.
• Own and drive development of next generation patterning processes and roadmaps.
• Design and execute comprehensive characterization plans and experiments.
• Establish control systems to optimize production performance and sustainment.
• Mentor engineers and communicate status/risks to stakeholders.

Skills

Strong collaboration

Problem-solving

Technical communication

DOE methodologies

Statistical analysis

Education

PhD in Chemical Engineering / Materials Science / Physics / Electrical Engineering or related field

Master's degree with 2+ years relevant experience

Bachelor's degree with 4+ years industry experience

Tools

JMP

Python

MATLAB

Job description

Job Details:Job Description:Business GroupIntel Foundry Technology Development is committed to delivering world-class manufacturing solutions that power Intel's product roadmap. The team leads advancements in semiconductor process engineering, enabling innovative device architectures and high-volume production. Joining this team means contributing to Intel's pursuit of excellence and maintaining its leadership in a dynamic, competitive market.About the RoleJoin Intel Logic Technology Development and help advance the next generation of patterning.You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications.Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.Core CompetenciesStrong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.Ability to communicate technical data and concepts to both technical and non-technical audiences.Qualifications:The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with relevant industry or graduate school research experience.-Or-Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 2 years of relevant industry or graduate school research experience.-Or-Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.Preferred Qualifications:4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.Experience in managing complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.Expertise in APC development and variability reduction in a manufacturing environment.Expertise in etch driven defect reduction and metrology in a manufacturing environment.Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.Join Intel's passionate and innovative team to help define the future of semiconductor technology. Your expertise and dedication will contribute to groundbreaking advancements in manufacturing processes and device development, making a meaningful impact on Intel's technology roadmap.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location:US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.