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Qualcomm Technologies, Inc. invites applications for its Modular Engineering Internship to work on next‑generation AI infrastructure and software. Interns will be aligned to projects in AI inference, compilers, GPU kernels, distributed systems, and developer tooling, under mentor guidance.
The program runs 11–14 weeks in Summer 2027, with opportunities across multiple modules. Includes relocation coverage and furnished housing for the internship period.
Qualcomm Technologies, Inc. invites applications for its Modular Engineering Internship to work on next‑generation AI infrastructure and software. Interns will be aligned to projects in AI inference, compilers, GPU kernels, distributed systems, and developer tooling, under mentor guidance.
The program runs 11–14 weeks in Summer 2027, with opportunities across multiple modules. Includes relocation coverage and furnished housing for the internship period.