Microelectronics Packaging Co-Op — Hands-On Tech & DOE

Skyworks; Nashua (NH); On-site; USD 36,000 - 65,000; Part time

Job summary

Skyworks is seeking a Microelectronics/Semiconductor Packaging Co-Op/Intern to support advanced packaging tech development. You will work with packaging, manufacturing, quality, and design engineers, plus external partners, to optimize packaging for high-performance products.

This Winter/Spring Coop runs January 2027 to June 2027, requiring a 6-month term before graduation. You will gain hands-on experience in materials evaluation, DOE, data analysis, and cross-functional collaboration within a

Qualifications

• Pursuing a Bachelor's or Master's degree in a relevant engineering field.
• Junior or Senior standing, or current graduate student.
• Strong analytical, problem-solving, and communication skills.
• Proficiency with Microsoft Office applications (Excel, Word, PowerPoint).
• Ability to work independently and collaboratively in a team.

Responsibilities

• Support packaging development and manufacturing projects.
• Evaluate and characterize packaging materials.
• Assist with package assembly process development and documentation. Conduct laboratory experiments and engineering studies to support product and process improvements.
• Collect, analyze, and present technical data to support engineering decisions.
• Assist with failure analysis investigations and root cause identification. Support DOE activities and prepare technical reports and presentations.
• Create and maintain engineering documentation, test plans, specifications, and work instructions.
• Collaborate with cross-functional teams and external OSAT partners.
• Maintain accurate engineering records and adhere to laboratory safety requirements.

Skills

Analytical skills

Problem solving

Communication

Microsoft Excel

Microsoft Word

Microsoft PowerPoint

Python

MATLAB

CAD tools (SolidWorks/Creo/AutoCAD)

Education

Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, Electrical Engineering, or Electronics and Computer Engineering

Tools

SolidWorks

Creo

AutoCAD

Minitab

JMP

MATLAB

Python

Job description

Skyworks is seeking a Microelectronics/Semiconductor Packaging Co-Op/Intern to support advanced packaging tech development. You will work with packaging, manufacturing, quality, and design engineers, plus external partners, to optimize packaging for high-performance products.

This Winter/Spring Coop runs January 2027 to June 2027, requiring a 6-month term before graduation. You will gain hands-on experience in materials evaluation, DOE, data analysis, and cross-functional collaboration within a