MEMS Process Engineer — Wafer-to-Pack, Yield & Reliability

Seek Thermal, Inc; Goleta (CA); On-site; USD 105,000 - 145,000; Full time

Job summary

Seek Thermal, Inc. seeks a MEMS Semiconductor & Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.

The fab-less role collaborates with external suppliers and covers front-end MEMS processes and back-end packaging in both cleanroom and non-cleanroom environments. You will sustain yield targets, develop new processes, qualify them for production, and work with suppliers and cross-functional teams on new-product introductions and

Qualifications

• BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred.
• 5+ years hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging (wafer bonding, die attach, wire bond, or hermetic sealing).
• Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress, outgassing, surface preparation for bonding).
• Demonstrated use of DOE, SPC, and FMEA in a production environment.
• Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it.
• Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineers.
• Occasional travel to suppliers and contract manufacturers.

Responsibilities

• Own and sustain MEMS fabrication processes (PECVD/sputter deposition, photolithography, DRIE and wet etch, sacrificial release) to yield, Cpk, and cost targets.
• Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding.
• Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring.
• Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions.
• Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material.
• Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process.
• Partner with device design, test, reliability, and engineering functions on new-product introduction and design-for-manufacturability reviews.

Job description

Seek Thermal, Inc. seeks a MEMS Semiconductor & Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.

The fab-less role collaborates with external suppliers and covers front-end MEMS processes and back-end packaging in both cleanroom and non-cleanroom environments. You will sustain yield targets, develop new processes, qualify them for production, and work with suppliers and cross-functional teams on new-product introductions and