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Intel Corporation’s TD Memory Quality and Reliability Internship offers hands-on experience in memory characterization, silicon data analytics, and statistical modeling to drive technology readiness for future process nodes.
You will analyze data from SRAM, RF, and Fuse memory test structures, develop predictive models, and present findings to engineering teams, working with Design, Device Engineering, PDE, and Yield groups.
Intel Corporation’s TD Memory Quality and Reliability Internship offers hands-on experience in memory characterization, silicon data analytics, and statistical modeling to drive technology readiness for future process nodes.
You will analyze data from SRAM, RF, and Fuse memory test structures, develop predictive models, and present findings to engineering teams, working with Design, Device Engineering, PDE, and Yield groups.