Manufacturing Engineer - Bar Process

Applied Optoelectronics, Inc.

Sugar Land (TX)

On-site

USD 90,000 - 130,000

Full time

14 days+

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Benefits offered by this job

Competitive salary

Health plans

401(k) match

Generous PTO with payout

Relocation package

Immigration sponsorships

Job summary

Applied Optoelectronics, Inc. is seeking a skilled engineer to maintain production flow by troubleshooting equipment and process issues in a semiconductor manufacturing environment.

The role involves calibration, monitoring quality, and driving continuous improvements to boost yield and throughput. The ideal candidate holds a Master's in a related field, has hands-on experience with wafer processing, automated equipment, and data analysis, and can work in a cleanroom while coordinating with

Qualifications

Master’s degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline.
Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing.
Experience maintaining automated manufacturing equipment.
Knowledge of semiconductor manufacturing processes.
Strong troubleshooting and root cause analysis skills.
Experience using Excel for data analysis.
Familiarity with LabVIEW is a plus.
Ability to work in a cleanroom environment.
Strong communication skills; proficient at negotiating with vendors.
Ability to lift or move items weighing up to 20 pounds.

Responsibilities

Troubleshoot production issues affecting cleaving, bar stacking/unstacking and dicing operations
Resolve equipment and work order issues to minimize production downtime
Support daily production activities to ensure smooth manufacturing flow
Perform daily calibration of cleaving and dicing equipment
Monitor equipment performance and coordinate preventive maintenance
Identify equipment-related problems and implement corrective actions
Perform root cause analysis on manufacturing issues
Analyze production data to identify process improvements
Improve yield, throughput, and process stability
Implement corrective and preventive actions (CAPA)
Develop process recipes for new products
Monitor daily production quality for abnormalities
Investigate defects related to cleaving and dicing processes
Collaborate with Quality Engineering to resolve manufacturing issues
Develop and maintain SOPs and work instructions
Train manufacturing technicians and operators
Collaborate with Production, Quality, Process Engineering, Production Control, and IT to improve manufacturing efficiency
Perform other duties as assigned
Intensively collaborate with vendor for new tool design proposal
Make FAT and SAT documents for new tools
In charge of new tool move in, installation, modification and qualification

Skills

Troubleshooting

Root cause analysis

Excel data analysis

LabVIEW familiarity

Communication skills

Vendor negotiation

Cleanroom environment

Physical ability 20 lbs

Education

Master's degree in Materials Engineering

Job description

This role is responsible for maintaining production flow by troubleshooting equipment and process issues, performing routine calibration and maintenance of equipment, monitoring product quality, and driving continuous process improvements to improve yield, quality, and throughput.

Primary Responsibilities

Troubleshoot production issues affecting cleaving, bar stacking/unstacking and dicing operations
Resolve equipment and work order issues to minimize production downtime
Support daily production activities to ensure smooth manufacturing flow
Perform daily calibration of cleaving and dicing equipment
Monitor equipment performance and coordinate preventive maintenance
Identify equipment-related problems and implement corrective actions
Perform root cause analysis on manufacturing issues
Analyze production data to identify process improvements
Improve yield, throughput, and process stability
Implement corrective and preventive actions (CAPA)
Develop process recipes for new products
Monitor daily production quality for abnormalities
Investigate defects related to cleaving and dicing processes
Collaborate with Quality Engineering to resolve manufacturing issues
Develop and maintain SOPs and work instructions
Train manufacturing technicians and operators
Collaborate with Production, Quality, Process Engineering, Production Control, and IT to improve manufacturing efficiency
Perform other duties as assigned
Intensively collaborate with vendor for new tool design proposal
Make FAT and SAT documents for new tools
In charge of new tool move in, installation, modification and qualification

Qualifications

Master’s degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline
Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing
Experience maintaining automated manufacturing equipment
Knowledge of semiconductor manufacturing processes
Strong troubleshooting and root cause analysis skills
Experience using Excel for data analysis
Familiarity with LabVIEW is a plus
Ability to work in a cleanroom environment
Strong communication skills; proficient at negotiating with vendors
Ability to lift or move items weighing up to 20 pounds

Location

This position will be on-site based in Sugar Land, Texas.

Benefits