Lead Wafer Process Engineer – Advanced Fabrication

MACOM; Lowell (MA); On-site; USD 117,000 - 171,000; Full time

Benefits offered by this job

Health insurance

401(k) plan

Paid time off

Professional development

Job summary

MACOM is seeking a Process Engineer to support backend wafer fabrication at our Lowell, MA facility. You will develop, optimize, and sustain manufacturing processes for GaN, GaAs, Si, and InP technologies with a focus on quality, yield, and safety.

This role requires hands-on work with grinding, polishing, CMP, and wafer bonding. You will partner with Device and Integration Engineering and Business Units to drive continuous improvement, document procedures, train operators, and ensure robust

Qualifications

• BS in Engineering with a minimum of 8 years of semiconductor/process experience.
• Experience with data mining, statistics, SPC, DOE, Lean manufacturing and structured problem-solving methodologies.
• U.S. Citizen or permanent resident due to ITAR restrictions.

Responsibilities

• Develop, improve, and sustain wafer fabrication processes in partnership with Device/Integration Engineering and Business Unit design teams.
• Provide hands-on support for grinding, polishing, CMP, wafer bonding, mounting/demounting and related processes.
• Ensure factory indicators are met and drive improvements in quality, yield, cost, process stability, productivity, and safety.
• Take ownership of processes including equipment selection, qualification, writeups, and training; update routing documentation.
• Communicate with management and cross-functional teams; maintain thorough process documentation and specifications.

Skills

Semiconductor processing

Wafer fabrication

Process optimization

Data analysis

DOE/experimental design

Lean Six Sigma

Cross-functional collaboration

Technical communication

Education

BS in Engineering

Tools

Statistical methods

SPC/DOE

Lean manufacturing

Job description

MACOM is seeking a Process Engineer to support backend wafer fabrication at our Lowell, MA facility. You will develop, optimize, and sustain manufacturing processes for GaN, GaAs, Si, and InP technologies with a focus on quality, yield, and safety.

This role requires hands-on work with grinding, polishing, CMP, and wafer bonding. You will partner with Device and Integration Engineering and Business Units to drive continuous improvement, document procedures, train operators, and ensure robust