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Hewlett Packard Enterprise seeks a mechanical/thermal engineer to lead liquid cooling of high-density server platforms, including cold plates, manifolds, and rack interfaces. You will define thermal architectures, run CFD analyses, and drive qualification tests to ensure reliability and performance across data-center deployments.
The role requires 4–6 years in mechanical/thermal engineering with Creo and CFD proficiency, and a hybrid work model with some in-office collaboration in Texas.
Hewlett Packard Enterprise seeks a mechanical/thermal engineer to lead liquid cooling of high-density server platforms, including cold plates, manifolds, and rack interfaces. You will define thermal architectures, run CFD analyses, and drive qualification tests to ensure reliability and performance across data-center deployments.
The role requires 4–6 years in mechanical/thermal engineering with Creo and CFD proficiency, and a hybrid work model with some in-office collaboration in Texas.