Hybrid Thermal Engineer - Liquid Cooling Lead

Hewlett Packard Enterprise Development LP

Spring (TX)

Hybrid

USD 96,000 - 221,000

Full time

7 days ago
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Job summary

Hewlett Packard Enterprise Development LP in Houston, TX is seeking a Thermal Engineer (Direct Liquid Cooling) to lead mechanical and thermal design of liquid-cooled server platforms and rack-level cooling architectures in a hybrid environment.

You will develop cooling solutions, perform CFD analyses, qualify thermal performance, and mentor juniors, collaborating with suppliers and manufacturing to enable high-density compute while meeting reliability and acoustics targets.

Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering required.
  • Strong foundation in heat transfer, fluid mechanics, thermodynamics and electronics cooling.
  • Experience with liquid cooling for server hardware and CFD/thermal modelling.

Responsibilities

  • Lead mechanical and thermal design of liquid-cooled server platforms and rack-level cooling architectures.
  • Develop cooling solutions including cold plates, manifolds, tubing routing and quick disconnects.
  • Define server and rack thermal architectures to meet performance and reliability targets.
  • Perform thermal analyses using CFD, analytical methods, and lab testing.
  • Drive root-cause analysis for thermal/mechanical issues and mentor juniors.
  • Engage with suppliers, ODMs and manufacturing partners on implementation.
  • Represent the team in architecture and design reviews.

Skills

Heat transfer
Fluid mechanics
Thermodynamics
Electronics cooling
Mechanical design
Creo
CFD tools
Thermal modeling

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Creo
CFD software

Job description

Hewlett Packard Enterprise Development LP in Houston, TX is seeking a Thermal Engineer (Direct Liquid Cooling) to lead mechanical and thermal design of liquid-cooled server platforms and rack-level cooling architectures in a hybrid environment.

You will develop cooling solutions, perform CFD analyses, qualify thermal performance, and mentor juniors, collaborating with suppliers and manufacturing to enable high-density compute while meeting reliability and acoustics targets.

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