Liquid-Cooling Architect — Senior Principal Thermal Engineer

Hobbsnews

Sunnyvale (CA)

On-site

USD 174,000 - 353,000

Full time

8 days ago
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Job summary

Hewlett Packard Enterprise is seeking a Senior Principal Thermal Engineer who specializes in advanced liquid cooling for high-performance networking, compute, and data-center hardware. You will define organizational thermal architectures and roadmaps for direct-to-chip cooling, immersion, and hybrid systems.

The role drives complex programs from concept to production, mentors engineers, and collaborates with mechanical, electrical, and manufacturing teams to optimize performance, cost, and

Qualifications

  • Bachelor’s or Master’s degree in Mechanical Engineering or related field.
  • 15+ years of engineering experience for Senior Principal level.
  • Experience leading electronics thermal design and liquid-cooling development.

Responsibilities

  • Define organization-wide thermal architectures and roadmaps for liquid-cooled hardware.
  • Lead system-level thermal architecture, analysis, and design from concept through production.
  • Perform thermal-fluid CFD modeling and correlate with test data.
  • Develop validation plans and oversee testing for components and systems.
  • Mentor engineers and influence cross-functional teams and leadership.

Skills

Liquid cooling
CFD/thermal modelling
CAD (SolidWorks)
Technical leadership
System-level design
Thermal architecture

Education

Bachelor’s or Master’s in Mechanical Engineering

Tools

FloTHERM/FloEFD
SolidWorks

Job description

Hewlett Packard Enterprise is seeking a Senior Principal Thermal Engineer who specializes in advanced liquid cooling for high-performance networking, compute, and data-center hardware. You will define organizational thermal architectures and roadmaps for direct-to-chip cooling, immersion, and hybrid systems.

The role drives complex programs from concept to production, mentors engineers, and collaborates with mechanical, electrical, and manufacturing teams to optimize performance, cost, and

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