Lead SPICE Modeling Engineer – RF/MMW & FDSOI

GlobalFoundries; Town of Malta (NY); On-site; USD 118,000 - 210,000; Full time

Job summary

GlobalFoundries is seeking a motivated, self-driven engineer to join the Ultra-Low-Power CMOS modeling team, focusing on compact SPICE models for FDSOI, FinFET and Bulk MOSFETs used in PDKs for RF/Digital/Analog applications.

The role requires advanced degrees in Electrical Engineering with emphasis on semiconductor physics; hands-on experience in device modeling, test structures, and model extraction tools (MBP/ICCAP) is highly valued.

Qualifications

• PhD in Electrical or Electronics Engineering with 8+ years of experience.
• Master’s in Electrical or Electronics Engineering with 12+ years of experience.
• Expertise in MOSFET physics, FDSOI, FinFET, and BSIM models is preferred.

Responsibilities

• Lead SPICE/compact model development for FDSOI, FinFET and Bulk technologies for RF/MMW.
• Design MOSFET characterization structures for compact model extraction.
• Deliver model-to-hardware correlation and technical recommendations.

Skills

Semiconductor physics

MOSFET modeling

RF/MMW modeling

Technical leadership

Education

PhD in Electrical Engineering

Master's in Electrical Engineering

Tools

MBP

ICCAP

Job description

GlobalFoundries is seeking a motivated, self-driven engineer to join the Ultra-Low-Power CMOS modeling team, focusing on compact SPICE models for FDSOI, FinFET and Bulk MOSFETs used in PDKs for RF/Digital/Analog applications.

The role requires advanced degrees in Electrical Engineering with emphasis on semiconductor physics; hands-on experience in device modeling, test structures, and model extraction tools (MBP/ICCAP) is highly valued.