Lead SMT Process Engineer: Lean Manufacturing & NPI

Jobtailor; New Haven (CT); On-site; USD 90,000 - 120,000; Full time

Job summary

Jobtailor in the United States is seeking a hands-on Manufacturing Engineer to develop and optimize PCBAs, including stencil design, solder paste application, pick-and-place, and reflow.

You will lead DOEs, PFMEA and drive continuous improvements with cross-functional teams, configure BOMs, resolve defects, support NPI, and ensure lean practices across production.

Qualifications

• Bachelor’s degree in Engineering or related field.
• Minimum 5 years SMT manufacturing experience.
• Proven Lean Manufacturing and process development experience.
• Proficiency with SMT equipment operation, programming and troubleshooting.
• Strong analytical and problem-solving abilities; lead root cause investigations.
• Proficient with MS Office (Word, Excel, PowerPoint, Access, Outlook).
• Excellent organizational and time management skills.
• Strong interpersonal skills and team collaboration.

Responsibilities

• Develop and optimize PCBAs manufacturing processes (stencil design, solder paste application, pick-and-place, reflow).
• Lead DOE, PFMEA and related methods to improve reliability and quality.
• Provide technical leadership to Operators and cross-functional teams.
• Configure BOMs and routings per product structures and procedures.
• Analyze and resolve PCBA defects; implement corrective actions.
• Continuously improve assembly operations for accuracy, efficiency and manufacturability.
• Support New Product Introduction activities for electronic assemblies.
• Specify and procure equipment, tools and instruments for new and existing processes.
• Maintain documentation of processes and procedures.
• Ensure Lean Manufacturing compliance and drive improvements in yield, cycle time, inventory accuracy and delivery.

Skills

Lean Manufacturing

SMT Equipment Operation

Process Development

Root Cause Analysis

Design of Experiments (DOE)

PFMEA

BOM Configuration

New Product Introduction (NPI)

Defect Analysis

Corrective Actions

Team Leadership

Education

Bachelor’s Degree in Engineering

Tools

MS Office Suite

SPI

AOI

Placement Equipment

Printers

Ovens

Job description

• Develop and optimize manufacturing processes for PCBAs, including stencil design, solder paste application, pick-and-place operations, and reflow soldering.
• Lead and participate in Design of Experiments (DOEs), Process Failure Mode and Effects Analysis (PFMEA), and other methodologies to enhance process reliability and product quality.
• Provide technical leadership to our Operators while supporting cross-functional teams.
• Configure Bills of Materials (BOMs) and routings in accordance with product structures, standards, and internal procedures.
• Analyze and resolve PCBA defects, identifying root causes and implementing corrective actions.
• Continuously evaluate and improve assembly operations for accuracy, efficiency, and manufacturability.
• Assist in New Product Introduction (NPI) activities for electronic assemblies, ensuring smooth transition from design to production.
• Specify and procure equipment, tools, and instruments required for new and existing processes.
• Maintain accurate documentation of processes and procedures.
• Ensure compliance with Lean Manufacturing principles and drive improvements in yield, cycle time, inventory accuracy, and delivery performance.

Requirements

• Bachelor’s Degree in an Engineering discipline preferred; work experience in the field will be considered.
• Minimum of 5 years of experience in SMT manufacturing, including conformal coating processes.
• Proven experience in Lean Manufacturing and process development.
• Proficiency in SMT equipment operation, programming, and troubleshooting (e.g., placement equipment, SPI, AOI, printers, ovens).
• Strong analytical and problem-solving skills with the ability to lead root cause investigations.
• Proficient in Microsoft Office Suite (Word, Excel, PowerPoint, Access, Outlook).
• Excellent organizational and time management skills.
• Strong interpersonal skills and ability to work effectively in a team-oriented environment.

Core Competencies

Demonstrates expertise in developing and optimizing manufacturing processes for PCBAs, with a strong focus on Lean Manufacturing principles and process reliability. Proficient in SMT equipment operation and capable of leading cross-functional teams to enhance product quality and efficiency.

Highest-signal resume keywords

• Lean Manufacturing
• SMT Equipment Operation
• Process Development
• Root Cause Analysis
• Design of Experiments (DOE)

ATS Optimization Keywords

Hard Skills

• Manufacturing Process Development
• Stencil Design
• Solder Paste Application
• Pick-and-Place Operations
• Reflow Soldering
• Process Failure Mode and Effects Analysis (PFMEA)
• Bills of Materials (BOM) Configuration
• New Product Introduction (NPI)
• Defect Analysis
• Corrective Actions

Soft Skills

• Analytical Skills
• Problem-Solving Skills
• Organizational Skills
• Time Management Skills
• Interpersonal Skills

Industry Keywords

• SMT Manufacturing
• Conformal Coating Processes
• Process Reliability
• Manufacturability
• Cycle Time Improvement

Tools & Technologies

• Microsoft Office Suite
• SPI
• AOI
• Placement Equipment
• Printers
• Ovens