Lead Photonic Product/Packaging Design Engineer

Uviquity; Raleigh (NC); On-site; USD 100,000 - 130,000; Full time

Job summary

A cutting-edge semiconductor startup in Raleigh is looking for a Lead Photonic Product/Packaging Design Engineer. The candidate will lead the design and release of innovative far-UVC light engines. This position requires a Master's degree and extensive experience in the photonic industry, emphasizing collaboration and hands-on capabilities. The role offers a chance to significantly impact product development in a transformative technology area.

Qualifications

• 6+ years of photonic industry experience in new product development.
• Expertise in semiconductor diode laser packaging.
• Strong experience in statistical data analysis/visualization.

Responsibilities

• Lead product design for innovative far-UVC light engines.
• Develop optoelectronic packaging solutions addressing multiple challenges.
• Coordinate with manufacturing partners to guide product design.

Skills

Hands-on assembly

Statistical data analysis/visualization

Mechanical design processes

Photonic assembly management

Analytic and communication skills

Education

Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, or Materials Science

Tools

SolidWorks

AutoDesk Inventor

Job description

Lead Photonic Product/Packaging Design Engineer

Uviquity is a deep tech startup pioneering the next generation of solid‑state far‑UVC light sources, enabling a new class of compact, energy‑efficient devices for disinfection, sensing, and advanced photonic applications. Founded in 2022 and backed by leading venture capital firms, we have partnered with multiple Fortune 500 companies and other international commercial partners to bring our innovations to market.

Position Overview

Uviquity is seeking an experienced Lead Photonic Product / Packaging Design Engineer to play a critical role in building the next generation of far‑UVC light engines for disinfection and sensing applications. This full‑time position will focus on the design and production release of photonic packages, requiring a candidate whose proven abilities show they can work across multiple disciplines. The candidate should be a hands‑on “doer”, eager to take ownership of product design challenges and execute detailed instructions with minimal oversight. Innovation, communication, and collaborative problem‑solving abilities are required.

Key Responsibilities

• Lead the product design and release for innovative packaged far‑UVC light engines that achieve industry‑leading performance
• Develop optoelectronic packaging solutions for hybrid and integrated photonic assemblies that address thermal, electrical, optical, and material science challenges
• Interface between R&D teams and manufacturing partners to guide photonic product design and ensure Design for Manufacturing/Assembly (DfMA) and Design for Quality
• Analyze product performance data sets and steer product requirements for prototype/pilot/production scaling
• Coordinate assembly specifications and change management controls for ramp to volume manufacturing
• Own supply‑chain resolutions, operational troubleshooting, and failure analysis (FA) throughout photonic product launch
• Document inspection instructions, test criteria, and non‑conformance actions in support of the manufacturing quality system
• Work with cross‑functional teams, consultants, and partners to ensure packages are cost‑effective and meet performance requirements
• Foster a collaborative and innovative culture across the organization, promoting knowledge sharing and continuous learning

Qualifications & Requirements

• Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or an equivalent field
• 6+ years of photonic (optoelectronic) industry experience in new product development (NPD) and prototype/pilot/product launch
• Expertise in hands‑on assembly and packaging for semiconductor diode laser packaging (e.g. 14‑pin butterfly, TO‑Cans, CoS, etc.)
• Expertise in coordinating and managing photonic assembly vendors
• Experience in statistical data analysis/visualization (such as with JMP, R, etc.)
• Proficient in mechanical design processes and 3D CAD software (such as SolidWorks or AutoDesk Inventor)
• Proficient in thermal and mechanical constraints of laser packaging, such as heat transfer, mechanical stress, and thermo‑electric cooling
• Knowledge of Statistical Process Control (SPC), Design for Manufacturing and Assembly (DfMA), Failure Analysis (FA), Root Cause Analysis, and Lean Manufacturing methods
• Knowledge of design constraints for on‑chip photonic devices (e.g. waveguides, couplers, lasers, etc.) and electronic packaging (e.g. wirebonds, interconnects, vias, etc.)
• Strong analytic and communication skills, flexibility, and ability to work well in a dynamic, multi‑disciplinary environment

Preferred Skills

• Ph.D. Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or an equivalent field
• Experience interacting directly with external photonic customers
• Experience working with blue laser diodes or other III‑Nitride based lasers
• Experience working with UV‑emitting devices
• Experience with transitioning product lines to external foundries and/or contract manufacturers
• Experience working in a semiconductor/wafer manufacturing environment

Why Join Uviquity

You’ll be joining a world‑class founding team at the forefront of far‑UVC semiconductor innovation with a mission to improve the air we breathe, the food we eat, and the water we drink. This is a rare chance to build the commercial foundation of a deep‑tech startup—shaping strategy, designing new product lines, and directly influencing the company’s trajectory and impact.

Seniority Level

Mid‑Senior level

Employment Type

Full‑time

Job Function

Information Technology

Industries

Semiconductor Manufacturing