Lead PCB Fabrication Engineer High-Speed SI/PI

AMD; United States; On-site; USD 150,000 - 190,000; Full time

Benefits offered by this job

Benefits at a glance

Job summary

AMD is seeking a talented Lead PCB fabrication process engineer to advance Datacenter GPU PCBs with a focus on high-speed SI/PI and reliable interconnects for volume production. You will collaborate with silicon/package design, validation, and supply chain to qualify technologies and drive improvements.

Ideal candidates bring a strong background in complex fabrication, test/failure analysis, and data-driven problem solving, with excellent communication across engineering and executive levels in

Qualifications

• Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical).
• Master's degree preferred in Electrical/Electronics & Computer Engineering.

Responsibilities

• Design high performance material stacks and complex via-structure interconnects for Datacenter GPU PCBs.
• Own process qualification and adoption of PCB fabrication technologies for SI/PI targets.
• Define technology roadmaps, vendor engagements, and robust design practices.
• Collaborate with silicon/package design, board engineering/layout, and cross-functional teams.
• Drive process improvements and rapid time-to-market product delivery.
• Contribute to platform quality from feasibility to mass production ramp.
• Work in a dynamic, fast-paced product development environment.

Skills

High-speed PCB design

Signal integrity (SI/PI)

Cross-functional collaboration

Scripting in Python/C++

Technical communication

Education

Bachelor's degree in Engineering

Master's degree in Electrical/Electronics & Computer Engineering

Tools

Allegro

3DXRM

SEM

FTIR Spectroscopy

DSC

DMA

Job description

AMD is seeking a talented Lead PCB fabrication process engineer to advance Datacenter GPU PCBs with a focus on high-speed SI/PI and reliable interconnects for volume production. You will collaborate with silicon/package design, validation, and supply chain to qualify technologies and drive improvements.

Ideal candidates bring a strong background in complex fabrication, test/failure analysis, and data-driven problem solving, with excellent communication across engineering and executive levels in