Lead Mechanical Engineer, High-Density Networking Enclosures

Aria Networks, Inc.; Palo Alto, Northern (CA, KY); Hybrid; USD 140,000 - 210,000; Full time

Job summary

Aria Networks, Inc. seeks a Mechanical Engineer to own the physical architecture and end-to-end development of high-density Ethernet switches.

You will tackle thermodynamic and structural challenges of 1000W+ ASICs and high-speed optics, guiding products from concept to global manufacturing ramp-up and field deployment. The role demands 8+ years in electronics packaging, expert CAD and physics-based analysis, and collaboration with CM partners to deliver robust, scalable solutions in a

Qualifications

• BS or MS in Mechanical Engineering with 8+ years in electronics packaging.
• Expert CAD proficiency: SolidWorks, Creo, or NX.
• Strong background in FEA/CFD (Ansys) and thermal analysis.
• Experience with Contract Manufacturers and mass production DFM/DFM DFA.
• Proven track record from concept to mass production.
• Experience with high-power platforms (ASICs/GPUs/CPUs) in constrained environments is a plus.
• Familiarity with OCP standards and liquid cooling is a plus.

Responsibilities

• Define mechanical enclosure and internal layout for high-density switches.
• Design and simulate cooling solutions for 500W–1000W+ ASICs.
• Perform 3D tolerance stacks to ensure alignment of high-speed connectors.
• Specify materials for rigidity, thermal conductivity, and EMI shielding.
• Lead setup and optimization of manufacturing lines and SOPs.
• Manage ECO process and communication between engineering, operations, and CM partners.
• Lead mechanical validation for shock, vibration, thermal cycling, and acoustic compliance.
• Lead DFx reviews and optimizations with CMs/JDMs.

Skills

Electronics packaging

Mass production

Thermal management

Education

BS/MS Mechanical Engineering

Tools

SolidWorks

Creo

NX

Ansys Mechanical

Ansys Icepak

FloTHERM

Job description

Aria Networks, Inc. seeks a Mechanical Engineer to own the physical architecture and end-to-end development of high-density Ethernet switches.

You will tackle thermodynamic and structural challenges of 1000W+ ASICs and high-speed optics, guiding products from concept to global manufacturing ramp-up and field deployment. The role demands 8+ years in electronics packaging, expert CAD and physics-based analysis, and collaboration with CM partners to deliver robust, scalable solutions in a