Lead Mechanical Engineer, Avionics & Spacecraft Packaging

Firefly Aerospace; Town of Texas (WI); On-site; USD 90,000 - 130,000; Full time

Job summary

Firefly Avionics Mechanical Engineers are responsible for designing rugged electronics packaging and electro-mechanical assemblies for launch vehicles. You will own complex subsystems, lead design architectures, and mentor junior engineers through full product lifecycles from concept to qualification.

Candidates should have a strong background in 3D CAD (NX), FEA (ANSYS), and multi-layer PCBA enclosure design, with experience in thermal and structural analysis under spaceflight conditions.

Qualifications

• Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or related field.
• 5+ years designing high-reliability electronics packaging and electro-mechanical assemblies.
• Experience with NX CAD and FEA tools such as ANSYS.
• Experience with multi-layer PCBA enclosure design and TIMs/CTE analysis.
• Knowledge of structural and thermal calculations for spaceflight environments.

Responsibilities

• Lead design and architecture of rugged electronics packaging and structural components for PCB assemblies.
• Design and optimize electro-mechanical assemblies for extreme environments and EMI/EMC compatibility.
• Perform and review advanced thermal analyses for electronics in space environments.
• Perform and review modal, random vibration, and shock analyses.
• Oversee design of high-reliability test fixtures and GSE for launch vehicle electronics.
• Lead environmental test campaigns for product qualification and acceptance.
• Create CAD models, drawings, and documentation; lead design reviews.
• Collaborate with PCB design team on mounting strategies and thermal management.
• Mentor junior engineers and establish design best practices.

Skills

3D CAD design

Thermal analysis

Vibration analysis

EMI/EMC

Project leadership

Education

Bachelor of Science in Mechanical Engineering or Aerospace Engineering

Tools

NX CAD

ANSYS

Job description

Firefly Avionics Mechanical Engineers are responsible for designing rugged electronics packaging and electro-mechanical assemblies for launch vehicles. You will own complex subsystems, lead design architectures, and mentor junior engineers through full product lifecycles from concept to qualification.

Candidates should have a strong background in 3D CAD (NX), FEA (ANSYS), and multi-layer PCBA enclosure design, with experience in thermal and structural analysis under spaceflight conditions.