Lead HBM Test Vehicle Design & Validation

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, dental & vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a technically skilled lead for HBM test-vehicle design and structure development. You will partner with product, technology and reliability teams to drive test content, specifications, measurements, and validation objectives.

You will analyze silicon data to identify optimization opportunities and guide future test vehicles, ensuring reliability and manufacturability across multiple memory programs.

Qualifications

• Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field.
• 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related subject areas.
• Strong understanding of semiconductor design and physical implementation fundamentals.
• Experience with silicon validation, characterization, data analysis, or failure investigation.
• Proficiency with demonstrating AI and AI-enabled development workflows.

Responsibilities

• Lead as a technical authority for HBM test vehicle design and structure development.
• Collaborate with HBM product, technology and reliability teams.
• Define and implement test structures and measurement requirements to support learning and reliability goals.
• Analyze silicon characterization results and communicate actionable recommendations across Design, Product and Tech Development teams.
• Support development of experimental vehicles to enable reuse across HBM programs.
• Lead investigations into design, process, and package interactions affecting performance and manufacturability.
• Contribute to design guidelines, protocols, and lessons learned for future programs.

Skills

AI workflows

Communication skills

Semiconductor fundamentals

Education

Master’s or PhD in Electrical Eng/CS/Materials/Physics

Tools

TSVs

Hybrid bonding

3D integration

Job description

Micron Technology, Inc. seeks a technically skilled lead for HBM test-vehicle design and structure development. You will partner with product, technology and reliability teams to drive test content, specifications, measurements, and validation objectives.

You will analyze silicon data to identify optimization opportunities and guide future test vehicles, ensuring reliability and manufacturability across multiple memory programs.