Lead EUV Lithography Equipment Engineer

Micron; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Retirement/401(k) plan

Job summary

Micron Technology is seeking a Staff or Principal EUV Equipment Engineer for its Boise, Idaho location. This technical leadership role focuses on maximizing EUV lithography system performance, reliability, and capability, with collaboration across engineering disciplines and with suppliers.

The role requires strong problem-solving, project leadership, and cross-functional communication to advance next-generation semiconductor technologies. Experience with ASML EUV or High-NA EUV is preferred.

Qualifications

• Bachelor’s degree in a technical field such as EE/ME/Physics/Materials Science or chemical engineering.
• 5+ years of semiconductor equipment engineering or manufacturing experience.
• Experience troubleshooting and improving complex semiconductor equipment.
• Proven ability to lead technically complex projects and drive performance gains.

Responsibilities

• Own performance, reliability, availability, and productivity of assigned EUV lithography equipment.
• Lead installations, upgrades, qualifications, maintenance strategies, and continuous improvement.
• Drive improvements in scanner performance, imaging stability, and defectivity reduction.
• Analyze data and implement monitoring to improve overlay, focus, and tool health.
• Provide technical leadership through supplier management and cross-functional collaboration.

Skills

EUV lithography

Equipment engineering

Problem solving

Cross-functional collaboration

Education

Bachelor's degree in engineering or related field

Tools

Scripting

Data analytics

Job description

Micron Technology is seeking a Staff or Principal EUV Equipment Engineer for its Boise, Idaho location. This technical leadership role focuses on maximizing EUV lithography system performance, reliability, and capability, with collaboration across engineering disciplines and with suppliers.

The role requires strong problem-solving, project leadership, and cross-functional communication to advance next-generation semiconductor technologies. Experience with ASML EUV or High-NA EUV is preferred.