Lead Embedded Edge AI Prototyping Engineer

Renesas Electronics Corporation

Columbia (MD)

On-site

USD 140,000 - 185,000

Full time

14 days+

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Paid time off

Job summary

Renesas Electronics is seeking a Senior Embedded Engineer to head our Edge AI Prototyping Lab in Columbia, MD. You will lead physical lab operations, drive PoCs, and guide DSP and TinyML deployments on Renesas MCUs.

The role blends hardware fabrication with advanced signal processing and embedded software leadership. You will mentor junior engineers, manage cross‑BU hardware integrations, and work with customers to demonstrate live edge solutions.

Qualifications

MS/PhD in Electrical Engineering, Computer Engineering, Applied Physics, or related field (or BSEE with leadership).
7–12+ years in embedded software, hardware prototyping, DSP, and real-time edge computing.
Lab fabrication, PCB bring-up, debugging with oscilloscopes and logic analyzers.
Strong C/C++ for constrained MCUs, bare-metal or RTOS, DMA handling.
DSP for time-series and on-device ML deployment on microcontrollers.

Responsibilities

Lead physical lab facilities, equipment, procurement, and project scheduling for PoCs.
Oversee hands-on assembly of prototype rigs, sensor arrays, and mounts.
Instrument high-frequency sensor data and preprocess datasets.
Design DSP feature extraction and deploy quantized TinyML on ARM Cortex-M / Renesas MCUs.
Collaborate with customers and internal teams to debug firmware and demonstrate solutions.
Mentor junior engineers in firmware, signal processing, and fabrication.