Lead 5G Modem Architect — OpenWrt & eSIM Expert

Ericsson

Santa Clara (CA)

In loco

USD 234.000 - 293.000

Tempo pieno

2 giorni fa
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Descrizione del lavoro

Ericsson Enterprise Wireless Solutions in Santa Clara, CA is seeking a Principal Modem Engineer to lead architecture and development of OpenWrt-based modem drivers and eSIM provisioning stacks for 5G applications. You will own the end-to-end connectivity stack, drive technical strategy, and mentor a growing team across embedded Linux and carrier-grade interfaces.

This role emphasizes high-performance, power-efficient modem solutions, collaboration with global teams and chipset partners, and

Competenze

  • 10+ years in embedded Linux, modem or telecom development.
  • 5+ years in cellular modem driver development.
  • 3+ years with eSIM/eUICC integration and OpenWrt.

Mansioni

  • Architect end-to-end modem and eSIM integration on OpenWrt platforms.
  • Design Linux kernel drivers for modem interfaces (USB/PCIe/SDIO).
  • Develop QMI/RMNET/AT command layers for modem control.
  • Lead carrier certification efforts (GCF, PTCRB) and GSMA compliance.
  • Define roadmap and drive CI/CD pipelines and test frameworks.
  • Mentor senior engineers and collaborate with operators and chipset vendors.

Conoscenze

Embedded Linux
Modem driver dev
eSIM integration
C/C++
OpenWrt
Linux kernel drivers
QMI RMNET
Leadership
CI/CD tooling
GSMA RSP

Formazione

Bachelor’s/Master’s in Electrical/Computer Engineering or CS

Strumenti

OpenWrt build system
Linux kernel
CI/CD tooling (Jenkins/GitLab)
eUICC provisioning stacks

Descrizione del lavoro

Ericsson Enterprise Wireless Solutions in Santa Clara, CA is seeking a Principal Modem Engineer to lead architecture and development of OpenWrt-based modem drivers and eSIM provisioning stacks for 5G applications. You will own the end-to-end connectivity stack, drive technical strategy, and mentor a growing team across embedded Linux and carrier-grade interfaces.

This role emphasizes high-performance, power-efficient modem solutions, collaboration with global teams and chipset partners, and

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