Intern, Dry Etch Equipment Development (Semiconductors)

Micron Technology; Boise (ID); On-site; USD 25,000 - 36,000; Full time

Job summary

Micron Technology in Boise, Idaho invites a hands-on internship in the Dry Etch Equipment Development Engineering group. You will develop, craft, and optimize plasma etch equipment for Micron memory parts and tackle technical problems to push the product roadmap forward.

We seek current students pursuing a B.S., M.S., or Ph.D in Engineering or related sciences, with curiosity, teamwork, and the ability to work independently and collaboratively on challenging hardware projects.

Qualifications

• Pursuing a degree in engineering or a related science field.
• Current student who cannot graduate before September 2027.
• Experience or familiarity with semiconductor equipment.

Responsibilities

• Demonstrate ownership of safety, quality, and compliance in lab, fab, and equipment environments.
• Presenting and clearly articulating your work.
• Conducting experiments to understand the technical limitations of current equipment capability.
• Developing in-process hardware and analytical techniques.
• Maintain data integrity in collection, analysis, documentation, and communication of technical results.
• Solving sophisticated engineering problems related to plasma etch hardware.
• Collaborate respectfully with cross-functional teams to solve equipment and process challenges.

Skills

Digital literacy

Data analysis

AI-enabled tools

Team collaboration

Education

B.S./M.S./Ph.D in Engineering

Tools

AI-enabled tools

Job description

Micron Technology in Boise, Idaho invites a hands-on internship in the Dry Etch Equipment Development Engineering group. You will develop, craft, and optimize plasma etch equipment for Micron memory parts and tackle technical problems to push the product roadmap forward.

We seek current students pursuing a B.S., M.S., or Ph.D in Engineering or related sciences, with curiosity, teamwork, and the ability to work independently and collaboratively on challenging hardware projects.