Intern: AI-Driven OPC/RET for Advanced Mask Tech

Micron

Boise (ID)

On-site

USD 25,000 - 39,000

Part time

14 days+
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Job summary

Micron Technology invites you to join the Advanced Mask Development Group for an internship focused on Optical Proximity Correction and Resolution Enhancement Techniques. Study lithography modeling, build AI workflows for RET/OPC tasks, and collaborate with the Photolithography group to automate the RET development flow.

Pursuing BS, MS, or PhD in Engineering or Science with graduation not before Sept 1, 2027; strong analytical skills and multi-tasking abilities are required.

Qualifications

  • Pursuing BS, MS, or PhD in Engineering or Science.
  • Graduation date should not be prior to September 1, 2027.
  • Validated analytical skills and ability to multitask across complex projects.
  • Experience or knowledge of lithography simulations and microfabrication concepts.

Responsibilities

  • Study and comprehend photolithography modeling theory and simulation methodology.
  • Build AI workflows and programs for RET/OPC tasks.
  • Improve metrics beyond the Process-Of-Record.
  • Document best-known methods with supporting data and learnings.
  • Collaborate with the Photolithography group on hands-on RET/OPC projects.
  • Develop automated scripts to improve current methodologies and identify improvement opportunities.

Skills

Analytical skills
Multi-tasking
Project management
Lithography simulations concept

Education

BS/MS/PhD in Engineering or Science

Tools

Python
Perl
MATLAB

Job description

Micron Technology invites you to join the Advanced Mask Development Group for an internship focused on Optical Proximity Correction and Resolution Enhancement Techniques. Study lithography modeling, build AI workflows for RET/OPC tasks, and collaborate with the Photolithography group to automate the RET development flow.

Pursuing BS, MS, or PhD in Engineering or Science with graduation not before Sept 1, 2027; strong analytical skills and multi-tasking abilities are required.

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