Impactful Quality Engineer – BGA Reballing & Process Improvement

Micross Logo

Round Rock (TX)

On-site

USD 85,000 - 110,000

Full time

14 days+

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Job summary

Micross Logo in Round Rock, TX is seeking a Quality Engineer to develop and maintain procedures for BGA re-balling and rework. You will monitor process metrics, perform FAIs and inspections, and collaborate with engineering to ensure repeatability.

The role requires hands-on experience with BGA reballing, X-ray inspection, and IPC standards, with a focus on CAPA and continuous improvement. On-site work in Round Rock offers growth and exposure to advanced microelectronics.

Qualifications

Bachelor’s degree in engineering or related technical field required or preferred.
3+ years of quality engineering experience in microelectronics/semiconductor industry.
Hands-on experience with BGA reballing, X-ray inspection, soldering standards and rework techniques.

Responsibilities

Develop, implement, and maintain quality control procedures specific to BGA re-balling and rework processes.
Monitor and analyze process performance metrics to identify trends, root causes, and opportunities for continuous improvement.
Conduct first article inspections (FAI), in-process audits, and final inspections of re-balled BGA components.
Collaborate with engineering and production teams to ensure process capability and repeatability.
Lead failure analysis and CAPA activities related to BGA re-balling defects.
Maintain compliance with IPC standards (IPC-7711/7721, IPC-A-610), IEC TS 62647-4, and customer requirements.
Support supplier quality initiatives for incoming BGA components and solder materials.
Document and maintain quality records, inspection reports, and process validation data.
Train operators and technicians on quality standards and inspection techniques for BGA re-balling.