IC Packaging Design Engineer

Canvendor; Chandler (AZ); On-site; USD 90,000 - 120,000; Full time

Job summary

Canvendor seeks an IC Packaging Design Engineer to work onsite in Chandler, AZ (and Hillsboro, OR as needed) on a 12+ month engagement.

The candidate will hold a Bachelor's or Master’s degree in Electrical/Electronics Engineering and bring hands-on experience with Siemens Mentor Xpedition or Cadence Allegro/APD. Focus areas include physical design, substrate integration, and ensuring performance, manufacturability and reliability.

Qualifications

• Degree in Electrical/Electronics engineering required.
• Hands-on experience with Xpedition or Cadence tools.
• Strong focus on physical design, substrate/layout and reliability.

Responsibilities

• Perform physical design & layout for IC packaging.
• Design substrate and layout integration for packages.
• Ensure design for performance, manufacturability, yield and reliability.

Skills

Physical design

Substrate design

Performance & reliability

Education

Bachelor’s or Master’s degree in Electrical/Electronics Engineering

Tools

Siemens Mentor Xpedition

Cadence Allegro/APD

Job description

Job Title : IC Packaging Design Engineer

Job Location : Chandler, AZ or Hillsboro, OR (Onsite)

Duration : 12+ Months

Job Description:

Bachelor’s or Master’s degree in Electrical /Electronics Engineering

Experience:

Strong hands‑on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Candidates should have experience in the below domains:

• Physical Design & Layout
• Substrate design and layout
• Design for performance, manufacturability, yield, and reliability