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Hewlett Packard Enterprise seeks a Thermal/Mechanical Engineering Intern to help design, analyze, test and validate cooling for next‑gen server hardware. You will work with a multidisciplinary team across mechanical, thermal, electrical and firmware engineers on air and liquid cooling concepts.
You will gain hands‑on experience in wiring, CAD, CFD/FEA, lab testing and engineering documentation within a hybrid schedule that includes two days per week in an HPE office.
Hewlett Packard Enterprise seeks a Thermal/Mechanical Engineering Intern to help design, analyze, test and validate cooling for next‑gen server hardware. You will work with a multidisciplinary team across mechanical, thermal, electrical and firmware engineers on air and liquid cooling concepts.
You will gain hands‑on experience in wiring, CAD, CFD/FEA, lab testing and engineering documentation within a hybrid schedule that includes two days per week in an HPE office.